MC9S12XET256CAG vs MC9S12XS256CAE Comparison
Detailed side-by-side comparison of MC9S12XET256CAG by NXP Semiconductors and MC9S12XS256CAE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S12XET256CAG | MC9S12XS256CAE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10.55 | $7.95 |
| Core | S12X (16-bit CISC) + XGATE co-processor | — |
| CPU Architecture | 16-bit HCS12X | — |
| Maximum Clock Frequency | 50 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 16 KB | — |
| EEPROM (emulated) | 4 KB | — |
| ADC | 16-channel, 12-bit | [DATA_NEEDED: adc_channels and resolution] |
| CAN Modules | 4 x CAN 2.0 A/B | — |
| GPIO | Up to 119 | — |
| Package | 144-LQFP (20x20 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch) |
| Supply Voltage | 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) | 1.72 V to 1.98 V (core); 5 V typical I/O supply |
| Operating Temperature | -40 C to +85 C (CAG grade, see datasheet) | -40C to +85C |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | [DATA_NEEDED: rohs_status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Memory Protection Unit | Yes (supervisor/user modes) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-bit |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| ROM Type | — | Flash |
| I/O Ports | — | 59 |
| Connectivity | — | CANbus, SCI, SPI |
| Mounting Style | — | SMD/SMT |
| Lifecycle Stage | — | ACTIVE |
| Peripherals | — | PWM, ECT (Enhanced Capture Timer), ADC, CAN, SCI, SPI |
| On-chip RAM | — | [DATA_NEEDED: ram_size] |
| Data Flash (DFLASH) | — | [DATA_NEEDED: dflash_size] |