MC9S12XET256CAG vs MC9S12XS256CAE 对比
详细并排对比 MC9S12XET256CAG 出自 NXP Semiconductors 和 MC9S12XS256CAE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S12XET256CAG | MC9S12XS256CAE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.55 | $7.95 |
| Core | S12X (16-bit CISC) + XGATE co-processor | — |
| CPU Architecture | 16-bit HCS12X | — |
| 最大时钟频率 | 50 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 16 KB | — |
| EEPROM (emulated) | 4 KB | — |
| ADC | 16-channel, 12-bit | [DATA_NEEDED: adc_channels and resolution] |
| CAN Modules | 4 x CAN 2.0 A/B | — |
| GPIO | Up to 119 | — |
| 封装 | 144-LQFP (20x20 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch) |
| 电源电压 | 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) | 1.72 V to 1.98 V (core); 5 V typical I/O supply |
| 工作温度 | -40 C to +85 C (CAG grade, see datasheet) | -40C to +85C |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: rohs_status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Memory Protection Unit | Yes (supervisor/user modes) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-bit |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| ROM Type | — | Flash |
| I/O Ports | — | 59 |
| Connectivity | — | CANbus, SCI, SPI |
| 安装方式 | — | SMD/SMT |
| Lifecycle Stage | — | ACTIVE |
| Peripherals | — | PWM, ECT (Enhanced Capture Timer), ADC, CAN, SCI, SPI |
| On-chip RAM | — | [DATA_NEEDED: ram_size] |
| Data Flash (DFLASH) | — | [DATA_NEEDED: dflash_size] |