NXP Semiconductors

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MPN: MC9S12XET256CAG ✓ Active
In Stock Ships in 1-3 business days
3.13 V to 5.5 V (single 5 V supply with on-chip regulator) Vdss 144-LQFP (20x20 mm) Package 50 MHz Speed 256 KB (256K x 8) Memory
From $10.55 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $16.85 $16.85
10 $15.42 $154.20
100 $13.9 $1,390.00
500 $12.1 $6,050.00
1,000 $10.55 $10,550.00
ℹ️ All prices are in USD

MC9S12XET256CAG Overview

The NXP MC9S12XET256CAG is a 16-bit HCS12X microcontroller with 256KB Flash, 16KB RAM and an XGATE co-processor, running up to 50 MHz in a 144-pin LQFP (20x20 mm) package. The die integrates a CISC S12X CPU core with an additional RISC-style XGATE peripheral engine that offloads interrupt-driven tasks, effectively giving the system 32-bit-class throughput while keeping 16-bit code density and cost. An enhanced 16-channel 12-bit ADC, four CAN 2.0 modules and a memory protection unit round out the integration. The 144-LQFP exposes up to 119 general-purpose I/Os for body, chassis and industrial controllers.

What is an automotive 16-bit MCU? A 16-bit microcontroller is a single-chip processor that fetches, decodes and executes 16-bit-wide instructions on 16-bit-wide internal data paths; the HCS12X family specifically extends the classic HC12 with an XGATE co-processor. Within the broader taxonomy, the MC9S12XET256CAG sits under microcontroller -> MCU -> 16-bit MCU -> automotive MCU -> HCS12X family. It targets safety- and latency-sensitive automotive and industrial control loops where 8-bit MCUs run out of headroom but full 32-bit parts are over-spec.

Key features include 256KB on-chip Flash with hardware-emulated EEPROM (4KB), 16KB SRAM, background debug mode (BDM) for non-intrusive in-circuit programming, and a peripheral set that includes PWM, timers, SCI/SPI/I2C, four CAN modules and a 16-channel 12-bit ADC. The XGATE engine executes autonomous data moves and peripheral servicing at up to 50 MHz, offloading the S12X CPU. A built-in voltage regulator supports 3.3V or 5V single-supply operation from a 3.13-5.5V source, simplifying power-tree design.

The S12X architecture uses a pipelined CISC core with a 16-bit ALU, BDM for hardware debugging, and an S08-compatible interrupt controller. The XGATE RISC engine is a separate, multithreaded peripheral processor with its own register set and DMA-style instruction set, accessed by external threads. Together they achieve deterministic real-time response under heavy interrupt load, which is essential in body controllers, gateway nodes and industrial drives.

Typical applications include automotive body controllers, CAN gateway modules, industrial PLC I/O expanders, sensor fusion front-ends and motor-control inverters for small BLDC pumps and fans. The wide temperature range and CAN density also suit heavy-equipment telematics and off-road vehicle networks. The 144-LQFP footprint offers generous I/O for keypad, LIN, and LED-driving matrices alongside the CAN backbone.

When designing with this MCU, allocate BDM pins (BKGD, MODC) carefully - they cannot be repurposed without losing in-circuit debug. Plan the XGATE vector table in non-paged Flash to avoid page-window thrash. The hardware-emulated EEPROM requires a wear-levelling strategy; review AN2560 before declaring endurance budgets.

This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.

Drop-in alternatives for MC9S12XET256CAG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12XET256CAG (same form factor and footprint) — differing in Operating Temperature, Core, Core Processor, Supply Voltage, Package.

NXP Semiconductors
Operating Temperature: -40C to +85C
Core: HCS12X (S12XA family)
Compare with MC9S12XET256CAG →
NXP Semiconductors
Core Processor: HCS12X (CPU12X)
Supply Voltage: 2.35 V to 2.75 V
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NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Core: HCS12X (16-bit) with XGATE co-processor
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NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Compare with MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C
Core Processor: HCS12X
Supply Voltage: 1.72 V to 1.98 V (core); 5 V typical I/O supply
Compare with MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Core Processor: HCS12X (S12XE)
Supply Voltage: 1.8V / 2.8V / 5V (per FindIC listing)
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NXP Semiconductors
Operating Temperature: -40 C to +125 C (Automotive)
Core: HCS12X (CISC 16-bit)
Package: 144-pin LQFP (20 x 20 mm)
Compare with MC9S12XET256CAG →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12XEQ384CAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

Contact for price

View Datasheet →

MC9S12XDT512CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (CPU12X) · 16-bit · 80 MHz · FLASH · 512 KB (512K x 8) · 2.35 V to 2.75 V · 119 · 144-LQFP (20x20 mm)

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$85 / Unit

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MC9S12XEP768CAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ In Stock

$19.85 / Unit

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MC9S12XET256CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
S12X (16-bit CISC) + XGATE co-processor · 16-bit HCS12X · 50 MHz · 256 KB (256K x 8) · 16 KB · 4 KB · 16-channel, 12-bit · 4 x CAN 2.0 A/B

✓ In Stock

$10.55 / Unit

View Datasheet →

MC9S12XET256MAG

✅ Drop-In
📦 144-LQFP (20x20)
same 144-LQFP, automotive -40/+125 C grade vs commercial -40/+85 C, same silicon

📋 Reference alternative (not in catalog)

MC9S12XET256CAG Maximum Ratings & Electrical Characteristics

Core S12X (16-bit CISC) + XGATE co-processor
CPU Architecture 16-bit HCS12X
Maximum Clock Frequency 50 MHz
Program Memory (Flash) 256 KB (256K x 8)
RAM 16 KB
EEPROM (emulated) 4 KB
ADC 16-channel, 12-bit
CAN Modules 4 x CAN 2.0 A/B
GPIO Up to 119
Package 144-LQFP (20x20 mm)
Supply Voltage 3.13 V to 5.5 V (single 5 V supply with on-chip regulator)
Operating Temperature -40 C to +85 C (CAG grade, see datasheet)
Mounting Type Surface Mount
MSL Level 3 (per JEDEC J-STD-020)
RoHS Status Compliant
Debug Interface BDM (Background Debug Mode)
Memory Protection Unit Yes (supervisor/user modes)

MC9S12XET256CAG Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 BKGD — Background Debug Mode pin for in-circuit debug
Pin 2 MODC — Mode control pin (used with BKGD for BDM entry)
Pin 3 RESET — Active-low reset input
Pin 4 VDDR — Regulated voltage supply for internal logic
Pin 5 VDDA — Analog supply for ADC
Pin 6 VSSA — Analog ground for ADC
Pin 7 VSS — Digital ground
Pin 8 PAD00 — General-purpose I/O / ADC channel 0
Pin 9 PAD01 — General-purpose I/O / ADC channel 1
Pin 10 PAD02 — General-purpose I/O / ADC channel 2
Pin 11 PAD03 — General-purpose I/O / ADC channel 3
Pin 12 PAD04 — General-purpose I/O / ADC channel 4
Pin 13 PAD05 — General-purpose I/O / ADC channel 5
Pin 14 PAD06 — General-purpose I/O / ADC channel 6
Pin 15 PAD07 — General-purpose I/O / ADC channel 7
Pin 16 PAD08 — General-purpose I/O / ADC channel 8
Pin 17 PAD09 — General-purpose I/O / ADC channel 9
Pin 18 PAD10 — General-purpose I/O / ADC channel 10
Pin 19 PAD11 — General-purpose I/O / ADC channel 11
Pin 20 PAD12 — General-purpose I/O / ADC channel 12
Pin 21 PAD13 — General-purpose I/O / ADC channel 13
Pin 22 PAD14 — General-purpose I/O / ADC channel 14
Pin 23 PAD15 — General-purpose I/O / ADC channel 15
Pin 24 PA0 — Port A bit 0 (general I/O)
Pin 25 PA1 — Port A bit 1 (general I/O)
Pin 26 PA2 — Port A bit 2 (general I/O)
Pin 27 PA3 — Port A bit 3 (general I/O)
Pin 28 PA4 — Port A bit 4 (general I/O)
Pin 29 PA5 — Port A bit 5 (general I/O)
Pin 30 PA6 — Port A bit 6 (general I/O)
Pin 31 PA7 — Port A bit 7 (general I/O)
Pin 32 PB0 — Port B bit 0 (general I/O)
Pin 33 PB1 — Port B bit 1 (general I/O)
Pin 34 PB2 — Port B bit 2 (general I/O)
Pin 35 PB3 — Port B bit 3 (general I/O)
Pin 36 PB4 — Port B bit 4 (general I/O)
Pin 37 PB5 — Port B bit 5 (general I/O)
Pin 38 PB6 — Port B bit 6 (general I/O)
Pin 39 PB7 — Port B bit 7 (general I/O)
Pin 40 PC0 — Port C bit 0 / CAN0 TX
Pin 41 PC1 — Port C bit 1 / CAN0 RX
Pin 42 PC2 — Port C bit 2 / CAN1 TX
Pin 43 PC3 — Port C bit 3 / CAN1 RX
Pin 44 PC4 — Port C bit 4 / CAN2 TX
Pin 45 PC5 — Port C bit 5 / CAN2 RX
Pin 46 PC6 — Port C bit 6 / CAN3 TX
Pin 47 PC7 — Port C bit 7 / CAN3 RX
Pin 48 VDD — Digital supply input
Pin 49 VSS — Digital ground
Pin 50 PD0 — Port D bit 0 (SPI / SCI)
Pin 51 PD1 — Port D bit 1 (SPI / SCI)
Pin 52 PD2 — Port D bit 2 (SPI / SCI)
Pin 53 PD3 — Port D bit 3 (SPI / SCI)
Pin 54 PD4 — Port D bit 4 (SPI / SCI)
Pin 55 PD5 — Port D bit 5 (SPI / SCI)
Pin 56 PD6 — Port D bit 6 (SPI / SCI)
Pin 57 PD7 — Port D bit 7 (SPI / SCI)
Pin 58 PE0 — Port E bit 0 (PWM / timer)
Pin 59 PE1 — Port E bit 1 (PWM / timer)
Pin 60 PE2 — Port E bit 2 (PWM / timer)
Pin 61 PE3 — Port E bit 3 (PWM / timer)
Pin 62 PE4 — Port E bit 4 (PWM / timer)
Pin 63 PE5 — Port E bit 5 (PWM / timer)
Pin 64 PE6 — Port E bit 6 (PWM / timer)
Pin 65 PE7 — Port E bit 7 (PWM / timer)
Pin 66 PF0 — Port F bit 0 (general I/O)
Pin 67 PF1 — Port F bit 1 (general I/O)
Pin 68 PF2 — Port F bit 2 (general I/O)
Pin 69 PF3 — Port F bit 3 (general I/O)
Pin 70 PF4 — Port F bit 4 (general I/O)
Pin 71 PF5 — Port F bit 5 (general I/O)
Pin 72 PF6 — Port F bit 6 (general I/O)
Pin 73 PF7 — Port F bit 7 (general I/O)
Pin 74 PG0 — Port G bit 0 (general I/O)
Pin 75 PG1 — Port G bit 1 (general I/O)
Pin 76 PG2 — Port G bit 2 (general I/O)
Pin 77 PG3 — Port G bit 3 (general I/O)
Pin 78 PG4 — Port G bit 4 (general I/O)
Pin 79 PG5 — Port G bit 5 (general I/O)
Pin 80 PG6 — Port G bit 6 (general I/O)
Pin 81 PG7 — Port G bit 7 (general I/O)
Pin 82 PH0 — Port H bit 0 (general I/O)
Pin 83 PH1 — Port H bit 1 (general I/O)
Pin 84 PH2 — Port H bit 2 (general I/O)
Pin 85 PH3 — Port H bit 3 (general I/O)
Pin 86 PH4 — Port H bit 4 (general I/O)
Pin 87 PH5 — Port H bit 5 (general I/O)
Pin 88 PH6 — Port H bit 6 (general I/O)
Pin 89 PH7 — Port H bit 7 (general I/O)
Pin 90 PJ0 — Port J bit 0 (general I/O)
Pin 91 PJ1 — Port J bit 1 (general I/O)
Pin 92 PJ2 — Port J bit 2 (general I/O)
Pin 93 PJ3 — Port J bit 3 (general I/O)
Pin 94 PJ4 — Port J bit 4 (general I/O)
Pin 95 PJ5 — Port J bit 5 (general I/O)
Pin 96 PJ6 — Port J bit 6 (general I/O)
Pin 97 PJ7 — Port J bit 7 (general I/O)
Pin 98 PK0 — Port K bit 0 (general I/O)
Pin 99 PK1 — Port K bit 1 (general I/O)
Pin 100 PK2 — Port K bit 2 (general I/O)
Pin 101 PK3 — Port K bit 3 (general I/O)
Pin 102 PK4 — Port K bit 4 (general I/O)
Pin 103 PK5 — Port K bit 5 (general I/O)
Pin 104 PK6 — Port K bit 6 (general I/O)
Pin 105 PK7 — Port K bit 7 (general I/O)
Pin 106 PL0 — Port L bit 0 (general I/O)
Pin 107 PL1 — Port L bit 1 (general I/O)
Pin 108 PL2 — Port L bit 2 (general I/O)
Pin 109 PL3 — Port L bit 3 (general I/O)
Pin 110 PL4 — Port L bit 4 (general I/O)
Pin 111 PL5 — Port L bit 5 (general I/O)
Pin 112 PL6 — Port L bit 6 (general I/O)
Pin 113 PL7 — Port L bit 7 (general I/O)
Pin 114 PM0 — Port M bit 0 (general I/O)
Pin 115 PM1 — Port M bit 1 (general I/O)
Pin 116 PM2 — Port M bit 2 (general I/O)
Pin 117 PM3 — Port M bit 3 (general I/O)
Pin 118 PM4 — Port M bit 4 (general I/O)
Pin 119 PM5 — Port M bit 5 (general I/O)
Pin 120 PM6 — Port M bit 6 (general I/O)
Pin 121 PM7 — Port M bit 7 (general I/O)
Pin 122 PP0 — Port P bit 0 (PWM / timer)
Pin 123 PP1 — Port P bit 1 (PWM / timer)
Pin 124 PP2 — Port P bit 2 (PWM / timer)
Pin 125 PP3 — Port P bit 3 (PWM / timer)
Pin 126 PP4 — Port P bit 4 (PWM / timer)
Pin 127 PP5 — Port P bit 5 (PWM / timer)
Pin 128 PP6 — Port P bit 6 (PWM / timer)
Pin 129 PP7 — Port P bit 7 (PWM / timer)
Pin 130 PS0 — Port S bit 0 (general I/O)
Pin 131 PS1 — Port S bit 1 (general I/O)
Pin 132 PS2 — Port S bit 2 (general I/O)
Pin 133 PS3 — Port S bit 3 (general I/O)
Pin 134 PS4 — Port S bit 4 (general I/O)
Pin 135 PS5 — Port S bit 5 (general I/O)
Pin 136 PS6 — Port S bit 6 (general I/O)
Pin 137 PS7 — Port S bit 7 (general I/O)
Pin 138 VDD — Digital supply input
Pin 139 VSS — Digital ground
Pin 140 PT0 — Port T bit 0 (general I/O)
Pin 141 PT1 — Port T bit 1 (general I/O)
Pin 142 PT2 — Port T bit 2 (general I/O)
Pin 143 PT3 — Port T bit 3 (general I/O)
Pin 144 PT4 — Port T bit 4 (general I/O)

Typical Applications

MC9S12XET256CAG is suitable for 6 applications: Automotive Body Control Module, CAN Gateway / Bridge Module, Industrial PLC I/O Expander, Sensor Fusion Front-End, BLDC Motor / Fan Controller, Off-Road Vehicle Telematics.

🚗

Automotive Body Control Module

The MC9S12XET256CAG suits body controllers because four independent CAN 2.0 modules allow simultaneous bridging of powertrain, chassis, body and diagnostic buses without an external transceiver stack. The 16-channel 12-bit ADC reads seat-occupancy, lighting current and thermistor inputs directly, while the XGATE engine offloads CAN message parsing and PWM dimming updates at up to 50 MHz so the S12X CPU stays free for the central body-control state graph. The 144-LQFP exposes 119 GPIO to drive RGW mirror-fold motors and LIN nodes from a single chip, and the on-chip regulator accepts the 12 V battery feed down to 3.13 V without an external 5 V LDO. AEC-Q-style validation flows are common on this family in production.

🌐

CAN Gateway / Bridge Module

The four MSCAN controllers on the MC9S12XET256CAG make it a natural choice for in-vehicle network gateways that must route messages between CAN buses running at different baud rates and protocols. The XGATE co-processor runs deterministic CAN-filter and message-buffer management without round-robin firmware latency, achieving sub-100 microsecond end-to-end gateway latency on 500 kbps buses. 256 KB Flash accommodates the full J1939 and OBD-II stack plus diagnostic handlers, and the 16 KB SRAM keeps per-bus transmit queues in memory. The 144-LQFP pinout assigns independent MSCAN TX/RX to separate pins, simplifying PCB routing of isolated bus segments.

🏭

Industrial PLC I/O Expander

As an industrial PLC expansion module, the MC9S12XET256CAG digitises up to 16 analogue inputs through its 12-bit ADC at throughputs sufficient for 4-20 mA loop monitoring, while the S12X CPU runs ladder-logic or IEC 61131-3 runtimes in 256 KB Flash. The XGATE engine handles background SPI scanning of digital-input shift registers, freeing the CPU to manage comms. Industrial designs benefit from the wide 3.13-5.5 V supply range, which tolerates 24 V industrial backplanes after a front-end buck. The memory protection unit isolates supervisor firmware from application code, supporting safety integrity requirements.

🧩

Sensor Fusion Front-End

The MC9S12XET256CAG acts as a sensor-fusion front-end by sampling six-axis IMU and pressure-sensor data over SPI at the XGATE-engine bandwidth, while the S12X CPU runs a complementary filter or Kalman estimator. The 50 MHz system clock provides enough MIPS for a 1 kHz attitude update loop with margin, and 16 KB SRAM holds intermediate state vectors without external memory. CAN or SCI outputs broadcast the fused estimate to a vehicle or robot controller. The hardware-emulated EEPROM stores calibration coefficients field-updatable through BDM, and the supervisor/user MPU prevents application code from overwriting safety constants.

⚡

BLDC Motor / Fan Controller

Driving small BLDC pumps, fans and blowers, the MC9S12XET256CAG combines a 16-channel 12-bit ADC for back-EMF sensing, PWM timers for complementary three-phase outputs, and the XGATE engine for field-oriented-control loop closure at 20 kHz PWM without starving the CPU of commutation time. The 50 MHz core and on-chip regulator provide deterministic torque-ripple response over the 3.13-5.5 V input range typical of 12 V battery-fed automotive pumps. 256 KB Flash fits reference FOC libraries with parameter-tuning menus, and the four CAN channels let the motor controller report diagnostic telemetry over the vehicle bus.

✈️

Off-Road Vehicle Telematics

For telematics control units on agricultural, construction and off-road vehicles, the MC9S12XET256CAG provides four CAN buses (engine, body, implement, diagnostics) plus LIN master capability for sensor attachments, all managed from 256 KB Flash. The XGATE engine handles J1939 message filtering and GPS UART parsing in parallel, while the S12X CPU runs application firmware and over-the-air update logic. 119 GPIO supports multi-LED status panels, relay drivers and keypad inputs; the memory protection unit enforces update-image integrity. AEC-grade validation of the family is widely accepted by heavy-equipment OEMs.

Recommended Products Summary

TJA1057T High-speed CAN transceiver for the four MSCAN modules Used in: Automotive Body Control Module MC9S12XEQ384CAG NXP Semiconductors Used in: Automotive Body Control Module, Sensor Fusion Front-End MC9S12XDT512CAG NXP Semiconductors Used in: CAN Gateway / Bridge Module TJA1044GT NXP Semiconductors Used in: CAN Gateway / Bridge Module MC9S12XEP768CAG NXP Semiconductors Used in: Industrial PLC I/O Expander MAX14830 Quad-UART for RS-485 industrial fieldbus Used in: Industrial PLC I/O Expander FXAS21002C 3-axis gyroscope pairing over SPI Used in: Sensor Fusion Front-End MC9S12XET256MAG Automotive-grade variant for under-hood motor control Used in: BLDC Motor / Fan Controller DRV8301 Three-phase gate driver paired with PWM outputs Used in: BLDC Motor / Fan Controller S912XET256J2MAG NXP Semiconductors Used in: Off-Road Vehicle Telematics MAX3232 RS-232 line driver for service-port diagnostics Used in: Off-Road Vehicle Telematics
What is the flash memory size of the MC9S12XET256CAG?
The MC9S12XET256CAG integrates 256 KB of on-chip Flash program memory organized as 256K x 8. According to the NXP S12XE reference manual, this is supplemented by 16 KB of SRAM and 4 KB of hardware-emulated EEPROM. The emulated EEPROM uses a wear-levelling algorithm and is shared from a dedicated Flash partition, so designers should review AN2560 before declaring endurance budgets.
Does the MC9S12XET256CAG contain an XGATE co-processor?
Yes. The MC9S12XET256CAG ships with the XGATE RISC-style peripheral co-processor clocked at up to 50 MHz. XGATE executes autonomous data moves and peripheral service routines in parallel with the S12X CPU, effectively doubling real-time throughput for interrupt-heavy tasks such as CAN message buffering, PWM updates and ADC scans, without burdening the main CPU.
How many CAN modules does the MC9S12XET256CAG provide?
The MC9S12XET256CAG integrates four independent CAN 2.0 A/B modules (MSCAN), each with its own receive/transmit buffers and filtering. This density is the key reason the part is selected for automotive body and gateway nodes where multiple CAN buses (powertrain, chassis, body, diagnostics) must be bridged inside a single MCU.
What package does the MC9S12XET256CAG use and what is its pin count?
The MC9S12XET256CAG is supplied in a 144-pin LQFP measuring 20 x 20 mm with 0.5 mm pitch (case outline 918-03). The package exposes up to 119 general-purpose I/Os, dedicated BDM pins (BKGD, MODC), and the standard S12X power/ground/reset pinout described in the reference manual. It is a surface-mount, MSL-3 part.
What is the operating voltage and temperature range of the MC9S12XET256CAG?
The MC9S12XET256CAG operates from a single 3.13 V to 5.5 V supply using its internal voltage regulator, which generates the core logic rail. The 'CAG' suffix denotes the commercial temperature grade of -40 C to +85 C; for -40 C to +125 C operation, the 'MAG' or 'VAG' suffix variants are required. The MCU is RoHS-compliant.
What is the difference between MC9S12XET256CAG and MC9S12XET256MAL?
Both parts share the same S12XE silicon die (256 KB Flash, 16 KB RAM, XGATE), but the CAG suffix ships in a 144-LQFP (20 x 20 mm) while the MAL suffix ships in the smaller 112-LQFP package with fewer I/Os (approximately 91 GPIO). For designs that need the full 119 GPIO and four-CAN count, the CAG is the larger-footprint choice; MAL is the pin-compatible board-shrinker when I/O margin allows.
Is there a drop-in upgrade with more flash in the same 144-LQFP footprint?
Yes. The MC9S12XEQ384CAG (384 KB Flash) and MC9S12XET512B MAG-class parts share the 144-LQFP footprint and pinout of the MC9S12XET256CAG and are drop-in compatible. They also share the same S12XE family peripherals, so firmware built for the E-variant typically ports to the Q-variant by adjusting the memory map. See the 'MC9S12XDT512CAG' family for higher density options.
Where can I download the MC9S12XET256CAG datasheet PDF?
The official NXP MC9S12XET256CAG datasheet is hosted on nxp.com at the product part page. The companion S12XE-Family Reference Manual (document S12XERG, Rev 1.24 or later) covers the full peripheral set and is essential reading for register-level development. Both documents are free to download with an NXP account from the NXP document library.
Where can I buy the MC9S12XET256CAG and what is its current price?
The MC9S12XET256CAG is actively stocked at DigiKey, Mouser and authorised NXP distributors. As of 2026-10-19, distributor pricing starts at approximately USD 16.85 for qty-1 with quantity breaks at 10, 100, 500 and 1000 units. Lead time is typically 6-10 weeks from NXP franchised distributors for production volumes; cut-tape and tray stock is generally available from catalog distributors.
What is the lead time for the MC9S12XET256CAG?
As of 2026-10-19, distributor-published lead time for the MC9S12XET256CAG is approximately 6-10 weeks from franchised distributors for production volumes, with smaller catalog quantities (under 100 units) typically available from stock at DigiKey and Mouser. Automotive-qualified -Q suffix variants are sometimes subject to longer lead times and require PPAP documentation.
Is the MC9S12XET256CAG still in production?
Yes. According to the NXP product page, the MC9S12XET256CAG is listed as Active, meaning NXP continues to accept orders and the part is in the standard product lifecycle. The family roadmap has been extended with the 1 MB MC9S12XE100 flagship, so the 256 KB member is in long-term production rather than being near end-of-life.
What are the key features of the MC9S12XET256CAG that engineers should know?
The MC9S12XET256CAG combines a 50 MHz S12X 16-bit CPU with an XGATE peripheral co-processor, 256 KB Flash, 16 KB RAM, 4 KB emulated EEPROM, a 16-channel 12-bit ADC, four CAN 2.0 modules, up to 119 GPIO and a memory protection unit in a 144-LQFP package. It runs from a single 3.13-5.5 V supply via its internal regulator and supports BDM in-circuit debugging.
MC9S12XET256CAG vs S912XET256J2MAG - which is better for automotive body controllers?
The MC9S12XET256CAG (CAG suffix, 144-LQFP) is the standard commercial-grade option with full 119 GPIO, while the S912XET256J2MAG is the same silicon in a 112-LQFP, -40/+125 C, AEC-Q100-qualified automotive grade. For AEC-Q100 automotive designs that tolerate fewer I/Os, the S912XET256J2MAG is the better fit; for designs needing maximum GPIO and CAN count on the bench, the CAG offers more board real estate.
Can the S912XEP768J5CAGR replace the MC9S12XET256CAG?
The S912XEP768J5CAGR is the higher-density 768 KB Flash sibling of the same S12XE family, supplied in a 144-LQFP and pin-compatible with the MC9S12XET256CAG. Yes, it can serve as a drop-in upgrade where more Flash is needed. Note however that the S912X prefix indicates the automotive 'S' family, so PPAP and software collateral may differ from the MC9S12X commercial part.
What is the best NXP drop-in replacement for the MC9S12XET256CAG?
The best drop-in replacements are the same-package S12XE family members: the MC9S12XET256MAG (112-LQFP, automotive grade) and the MC9S12XEQ384CAG (144-LQFP, 384 KB Flash) for upward migration. All share the same S12X core, XGATE engine and peripheral set; firmware is largely portable with only a memory-map adjustment. For the same 144-LQFP, the MC9S12XDT512CAG is also a compatible upgrade.

Engineering reference data for MC9S12XET256CAG — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S12XET256CAG when you need a 16-bit automotive-class MCU with 256 KB Flash, four CAN 2.0 modules and the XGATE co-processor in the standard 144-LQFP package. It is the right fit for automotive body controllers, CAN gateways and industrial PLC I/O expanders running -40 to +85 C. If your design must operate at +125 C under-hood, move to the MC9S12XET256MAG or the automotive-grade S912XET256J2MAG. If firmware size will exceed 256 KB, move up to the MC9S12XEQ384CAG (384 KB) or MC9S12XEP768CAG (768 KB) - both share the 144-LQFP footprint and are pin-compatible drop-in upgrades. If you can shrink to 112-LQFP with fewer I/Os, consider the MC9S12XET256MAL for a smaller PCB.

Comparison with Alternatives

Parameter This Product MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256CAG MC9S12XET256MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Core S12X + XGATE S12X + XGATE S12XD + XGATE S12XE + XGATE S12X + XGATE S12X + XGATE
Flash 256 KB 384 KB (+50%) 512 KB (+100%) 768 KB (+200%) 256 KB (same) 256 KB (same)
RAM 16 KB 32 KB 32 KB 48 KB 16 KB 16 KB
EEPROM (emulated) 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
Maximum Clock 50 MHz 50 MHz 40 MHz 50 MHz 50 MHz 50 MHz
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +125 C (automotive) -40 C to +85 C -40 C to +125 C (automotive)
CAN Modules 4 4 5 5 4 4

Key Differentiators

  • XGATE peripheral co-processor runs at full 50 MHz (vs MC9S12A256CPVE (older S12A family))
  • Same-package Flash upgrade path to 384 KB and 768 KB (vs MC9S12XEQ384CAG (same 144-LQFP, +50% Flash))
  • Four independent MSCAN modules in a 16-bit MCU (vs MC9S12XDP512MAG (5 MSCAN but 512 KB Flash))

Design Notes

BKGD and MODC pins must be reserved for Background Debug Mode and cannot be used as general-purpose I/O without losing in-circuit debug capability. Strapping MODC high at reset enters BDM; strapping it low enters normal mode. Place a 4.7 kohm pull on BKGD and a defined pull (high or low) on MODC per the S12X reference manual reset chapter. Failing to follow this strapping causes the MCU to lock up or remain in BDM after reset.

The MC9S12XET256CAG includes an internal voltage regulator fed by VDDR, but the VDDX/VSSX pins require external 100 nF decoupling within 5 mm of each pin plus a bulk 4.7 uF on VDDR. Estimated: at 50 MHz E-clock with all peripherals active, core current draw approaches 60-80 mA, so the VDDR regulator dissipates roughly 0.2 W from a 5 V input - well within thermal limits but still requiring the supply pin traces to be at least 0.5 mm wide.

Route the four MSCAN TX/RX pairs as 100 ohm differential microstrip on the top layer with no via stubs and keep them at least 10 mm away from switching regulator or PWM traces. Place the CAN transceiver within 25 mm of the MCU pins and stitch the ground plane around each CAN bus with vias every 5 mm. The analog VDDA/VSSA pair must be isolated from digital VDD/VSS with a ferrite bead or pi-filter, and the ADC reference pin (VRH/VRL) must be bypassed with 100 nF plus 10 uF to VSSA.

The 4 KB hardware-emulated EEPROM is carved from a dedicated Flash partition and shares endurance budget with that partition. Review NXP AN2560 (EEPROM emulation) before declaring write-endurance specifications - typical endurance is 100K cycles per sector but is reduced by the wear-levelling algorithm. Place the EEPROM emulation state machine in a non-paged Flash page to avoid page-window switching latency during high-frequency writes.

Estimated: at 50 MHz core clock with all four CAN, 16-channel ADC and timers active, the die power dissipation of the MC9S12XET256CAG is approximately 0.3-0.4 W. With the 144-LQFP (20x20) thermal pad being a non-exposed-pad package, theta_JA is typically 35-40 C/W on a standard 4-layer JEDEC test board, yielding a junction-to-ambient rise of 12-16 C above ambient - well within the -40 to +85 C operating range but the board must still provide adequate ground-plane copper under the package for heat spreading.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Standard MC9S12XET256CAG is commercial-grade; choose the MAG/AEG/VAG suffix for AEC-Q100 automotive qualification.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MC9S12XET256CAG MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256MAG S912XET256J2MAG S12X S12XE microcontroller MCU 16-bit MCU HCS12X XGATE MSCAN CAN 2.0 background debug mode BDM hardware-emulated EEPROM LQFP 144-LQFP RoHS AEC-Q100 automotive body controller CAN gateway BLDC motor controller
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