MCF5281CVM80 vs MCF5280CVM80J Comparison

Detailed side-by-side comparison of MCF5281CVM80 by NXP Semiconductors and MCF5280CVM80J by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5281CVM80 MCF5281CVM80 - 80MHz ColdFire V2 MCU 256KB Flash | NXP

MCF5281CVM80 - 80MHz ColdFire V2 MCU 256KB Flash | NXP

MCF5281CVM80 Nrnd
NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete

Specification Comparison

Parameter MCF5281CVM80 MCF5280CVM80J
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $36.80 $9.10
Core Processor ColdFire V2 ColdFire V2
Core Size 32-Bit 32-Bit Single-Core
Maximum Clock Speed 80 MHz —
Program Memory Size 256 KB (256K x 8) Flash ROMless (0 KB internal flash, code via external bus)
RAM Size 64 KB (64K x 8) —
Number of I/O 142 [DATA_NEEDED: GPIO count from datasheet]
Supply Voltage 3.3 V —
Package / Case 256-MAPBGA (17x17 mm) —
Mounting Type Surface Mount Surface Mount (BGA)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART CANbus, Ethernet (10/100 MAC), I2C, SPI, UART
Peripherals DMA, LVD, POR, PWM, WDT DMA, PWM, WDT, 16-bit timers, external memory controller
Oscillator Type External —
Operating Temperature -40C to +85C (industrial) -40C to +105C (TJ, industrial grade)
Temperature Grade Industrial Industrial
Terminal Form BALL —
Number of Terminals 256 —
Package Code LBGA —
Package Shape SQUARE —
MSL Level 3 3 (per JEDEC J-STD-020, typical for MAPBGA)
RoHS Status [DATA_NEEDED: rohs status] Compliant (Pb-free reflow profile)
Part Status Not For New Designs (NRND) —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Series — MCF528x (ColdFire V2)
Maximum CPU Clock — 80 MHz
Program Memory Type — ROMless (external flash required)
Package — 256-MAPBGA (17x17 mm)
Ethernet — 10/100 MAC integrated (MII/RMII interface to external PHY)
CAN — CAN 2.0 controller integrated
Debug Interface — JTAG / BDM (Background Debug Mode)
Lead-Free Finish — Yes (Matte Tin, SAC solder compatible)

Datasheets & Resources

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