MCF5281CVM80 vs MCF5280CVM80J Comparação
Comparação detalhada lado a lado de MCF5281CVM80 por NXP Semiconductors e MCF5280CVM80J por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MCF5281CVM80 | MCF5280CVM80J |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $36,80 | $9,10 |
| Core Processor | ColdFire V2 | ColdFire V2 |
| Core Size | 32-Bit | 32-Bit Single-Core |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | ROMless (0 KB internal flash, code via external bus) |
| RAM Size | 64 KB (64K x 8) | — |
| Number of I/O | 142 | [DATA_NEEDED: GPIO count from datasheet] |
| Tensão de alimentação | 3.3 V | — |
| Encapsulamento / Caixa | 256-MAPBGA (17x17 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART | CANbus, Ethernet (10/100 MAC), I2C, SPI, UART |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, PWM, WDT, 16-bit timers, external memory controller |
| Oscillator Type | External | — |
| Temperatura de operação | -40C to +85C (industrial) | -40C to +105C (TJ, industrial grade) |
| Temperature Grade | Industrial | Industrial |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | LBGA | — |
| Package Shape | SQUARE | — |
| Nível MSL | 3 | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (Pb-free reflow profile) |
| Part Status | Not For New Designs (NRND) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | MCF528x (ColdFire V2) |
| Maximum CPU Clock | — | 80 MHz |
| Program Memory Type | — | ROMless (external flash required) |
| Encapsulamento | — | 256-MAPBGA (17x17 mm) |
| Ethernet | — | 10/100 MAC integrated (MII/RMII interface to external PHY) |
| CAN | — | CAN 2.0 controller integrated |
| Debug Interface | — | JTAG / BDM (Background Debug Mode) |
| Lead-Free Finish | — | Yes (Matte Tin, SAC solder compatible) |