MCF53015CMJ240J vs MCF53017CMJ240 Comparison
Detailed side-by-side comparison of MCF53015CMJ240J by NXP Semiconductors and MCF53017CMJ240 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCF53015CMJ240J - ColdFire V3 MPU 240MHz | 256-MAPBGA | NXP
MCF53015CMJ240J ⚠ Last Time BuySpecification Comparison
| Parameter | MCF53015CMJ240J | MCF53017CMJ240 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $22.85 | $0.00 |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| Package | 256-MAPBGA (17x17 mm) | — |
| Number of I/O | 83 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, Memory Card, SSI, SPI, UART/USART, USB, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Core Feature | EMAC (Enhanced Multiply-Accumulate) | — |
| On-chip Voice Codec | Yes (integrated) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/VIo voltage range] | — |
| Operating Temperature Range | Industrial grade (per Freescale datasheet Partstack record) | — |
| Mounting Type | Surface Mount (BGA) | Surface mount |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | Compliant (per NXP product family policy) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Halogen Free | [DATA_NEEDED: halogen status] | — |
| Ethernet MAC | Integrated 10/100 Ethernet MAC | EMAC |
| Lifecycle Status | Last Time Buy | — |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Supply Voltage | — | 3.3 V |
| Memory Configuration | — | ROMless |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |