MCF53015CMJ240J vs MCF53017CMJ240 Сравнение
Подробное сравнение бок о бок MCF53015CMJ240J от NXP Semiconductors и MCF53017CMJ240 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MCF53015CMJ240J - ColdFire V3 MPU 240MHz | 256-MAPBGA | NXP
MCF53015CMJ240J ⚠ Последняя закупкаСравнение характеристик
| Параметр | MCF53015CMJ240J | MCF53017CMJ240 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Последняя закупка | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $22,85 | $0,00 |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| Корпус | 256-MAPBGA (17x17 mm) | — |
| Number of I/O | 83 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, Memory Card, SSI, SPI, UART/USART, USB, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Core Feature | EMAC (Enhanced Multiply-Accumulate) | — |
| On-chip Voice Codec | Yes (integrated) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/VIo voltage range] | — |
| Диапазон рабочих температур | Industrial grade (per Freescale datasheet Partstack record) | — |
| Тип монтажа | Surface Mount (BGA) | Surface mount |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Статус RoHS | Compliant (per NXP product family policy) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Без галогенов | [DATA_NEEDED: halogen status] | — |
| Ethernet MAC | Integrated 10/100 Ethernet MAC | EMAC |
| Статус жизненного цикла | Last Time Buy | — |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Напряжение питания | — | 3.3 V |
| Memory Configuration | — | ROMless |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Рабочая температура | — | [DATA_NEEDED: operating temperature range] |