MCF53015CMJ240J vs MCF53017CMJ240 Vergleich
Detaillierter Direktvergleich von MCF53015CMJ240J von NXP Semiconductors und MCF53017CMJ240 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF53015CMJ240J - ColdFire V3 MPU 240MHz | 256-MAPBGA | NXP
MCF53015CMJ240J ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MCF53015CMJ240J | MCF53017CMJ240 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,85 | $0,00 |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| Gehäuse | 256-MAPBGA (17x17 mm) | — |
| Number of I/O | 83 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, Memory Card, SSI, SPI, UART/USART, USB, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Core Feature | EMAC (Enhanced Multiply-Accumulate) | — |
| On-chip Voice Codec | Yes (integrated) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/VIo voltage range] | — |
| Betriebstemperaturbereich | Industrial grade (per Freescale datasheet Partstack record) | — |
| Montageart | Surface Mount (BGA) | Surface mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant (per NXP product family policy) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Halogenfrei | [DATA_NEEDED: halogen status] | — |
| Ethernet MAC | Integrated 10/100 Ethernet MAC | EMAC |
| Lebenszyklusstatus | Last Time Buy | — |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Versorgungsspannung | — | 3.3 V |
| Memory Configuration | — | ROMless |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |