MCF5329CVM240 vs MCF5327CVM240J Comparison

Detailed side-by-side comparison of MCF5329CVM240 by NXP Semiconductors and MCF5327CVM240J by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd
NXP Semiconductors
MCF5327CVM240J MCF5327CVM240J - ColdFire V3 240MHz MPU 196-LBGA | NXP

MCF5327CVM240J - ColdFire V3 240MHz MPU 196-LBGA | NXP

MCF5327CVM240J ✓ Active

Specification Comparison

Parameter MCF5329CVM240 MCF5327CVM240J
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $25.60 $15.95
Core Architecture ColdFire V3 (VLRISC) ColdFire V3 (32-bit RISC, variable-length)
Core Bit Width 32-bit —
Maximum Clock Frequency 240 MHz 240 MHz
On-chip SRAM 32 KB —
Unified Cache 16 KB write-back —
Program Memory Type ROMless (external memory bus required) —
Number of I/O Lines 94 94
Package 256-LBGA (MAPBGA) 196-LBGA (MAPBGA) 15x15 mm
Mounting Type Surface Mount Surface Mount
Supply Voltage 1.5 V core / 3.3 V I/O (typical, refer to datasheet) —
Operating Temperature -40C to +85C (industrial) —
Oscillator Type External External
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire) —
Ethernet 10/100 MAC integrated —
USB USB 2.0 Full-Speed OTG USB 2.0 Full-Speed OTG
Debug Interface JTAG/BDM/OnCE —
Packaging Tray —
RoHS Status Compliant Compliant
Performance — 211 MIPS
Internal SRAM — 32 KB
Program Memory — ROMless (external memory interface)
Operating Temperature Grade — Industrial
Integrated LCD Controller — Yes (TFT, up to 800x600)
Ethernet MAC — Yes (10/100)
CAN — Yes
JTAG / BDM Debug — Yes

Datasheets & Resources

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