MMA2301EGR2 vs MMA2301EG Comparison
Detailed side-by-side comparison of MMA2301EGR2 by NXP Semiconductors and MMA2301EG by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MMA2301EGR2 - ±200g X-Axis MEMS Accelerometer | NXP | Industrial
MMA2301EGR2 ✓ ActiveSpecification Comparison
| Parameter | MMA2301EGR2 | MMA2301EG |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Motion Sensors | Motion Sensors |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.40 | $9.95 |
| Sensor Type | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Axis | X | X (single axis) |
| Acceleration Range (nominal) | +/-200 g | — |
| Acceleration Range (tested) | +/-225 g | — |
| Supply Voltage | 5 V | 5.0 V typical (ratiometric output) |
| Sensitivity | 9.5 mV/g to 10.5 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Output Type | Analog, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 400 Hz (4-pole low-pass) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Operating Temperature | -40C to +125C | −40 °C to +125 °C (automotive) |
| Package | 16-pin SOIC, case 475-01 (Tape & Reel) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Sensing Technology | Silicon capacitive micromachined (MEMS) | — |
| Filter | 4-pole low-pass (factory set) | — |
| Temperature Compensation | On-chip active compensation | — |
| Lead Free Status | Lead Free Compliant by Exemption | Lead Free – Compliant by Exemption |
| RoHS Status | RoHS Compliant | RoHS Compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MMA | — |
| Measurement Range | — | ±225 g (full scale); 200 g nominal |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |