MMA2301EGR2 vs MMA2301EG Comparação
Comparação detalhada lado a lado de MMA2301EGR2 por NXP Semiconductors e MMA2301EG por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MMA2301EGR2 - ±200g X-Axis MEMS Accelerometer | NXP | Industrial
MMA2301EGR2 ✓ AtivoComparação de especificações
| Parâmetro | MMA2301EGR2 | MMA2301EG |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Motion Sensors | Motion Sensors |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $7,40 | $9,95 |
| Tipo de sensor | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Axis | X | X (single axis) |
| Acceleration Range (nominal) | +/-200 g | — |
| Acceleration Range (tested) | +/-225 g | — |
| Tensão de alimentação | 5 V | 5.0 V typical (ratiometric output) |
| Sensitivity | 9.5 mV/g to 10.5 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Tipo de saída | Analog, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 400 Hz (4-pole low-pass) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Temperatura de operação | -40C to +125C | −40 °C to +125 °C (automotive) |
| Encapsulamento | 16-pin SOIC, case 475-01 (Tape & Reel) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Sensing Technology | Silicon capacitive micromachined (MEMS) | — |
| Filter | 4-pole low-pass (factory set) | — |
| Temperature Compensation | On-chip active compensation | — |
| Lead Free Status | Lead Free Compliant by Exemption | Lead Free – Compliant by Exemption |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MMA | — |
| Faixa de medição | — | ±225 g (full scale); 200 g nominal |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |