MMA2301EGR2 vs MMA2301EG Comparaison
Comparaison détaillée côte à côte de MMA2301EGR2 par NXP Semiconductors et MMA2301EG par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MMA2301EGR2 - ±200g X-Axis MEMS Accelerometer | NXP | Industrial
MMA2301EGR2 ✓ ActifComparaison des spécifications
| Paramètre | MMA2301EGR2 | MMA2301EG |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Motion Sensors | Motion Sensors |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $7,40 | $9,95 |
| Type de capteur | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Axis | X | X (single axis) |
| Acceleration Range (nominal) | +/-200 g | — |
| Acceleration Range (tested) | +/-225 g | — |
| Tension d'alimentation | 5 V | 5.0 V typical (ratiometric output) |
| Sensitivity | 9.5 mV/g to 10.5 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Type de sortie | Analog, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 400 Hz (4-pole low-pass) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Température de fonctionnement | -40C to +125C | −40 °C to +125 °C (automotive) |
| Boîtier | 16-pin SOIC, case 475-01 (Tape & Reel) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Sensing Technology | Silicon capacitive micromachined (MEMS) | — |
| Filter | 4-pole low-pass (factory set) | — |
| Temperature Compensation | On-chip active compensation | — |
| Lead Free Status | Lead Free Compliant by Exemption | Lead Free – Compliant by Exemption |
| Statut RoHS | RoHS Compliant | RoHS Compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MMA | — |
| Plage de mesure | — | ±225 g (full scale); 200 g nominal |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |