MMA6262QR2 vs MMA6263QR2 Comparison
Detailed side-by-side comparison of MMA6262QR2 by NXP Semiconductors and MMA6263QR2 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Last Time BuySpecification Comparison
| Parameter | MMA6262QR2 | MMA6263QR2 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Motion Sensors | Motion Sensors |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5.20 | $5.45 |
| Sensor Type | Accelerometer, Dual-Axis (X, Y) | Accelerometer, Dual Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g (g-select to ±6 g) |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | — |
| Output Type | Analog, Ratiometric | Analog, ratiometric voltage |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | On-chip factory trimmed |
| Operating Temperature | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | — |
| Package / Case | 16-QFN-EP (6x6 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| RoHS Status | RoHS3 Compliant | RoHS Compliant |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Supply Voltage | — | 3.3 V nominal (range per datasheet) |
| Bandwidth | — | 900 Hz sensor bandwidth |
| Low-Pass Filter | — | 1-pole on-chip, ~400 Hz cutoff |
| Zero-g Output (Typ) | — | 1.65 V (mid-supply) |
| Self-Test | — | Logic-level input on each axis |
| Package | — | 16-QFN-EP (6x6 mm) with exposed pad |
| Lead Status | — | Contains Lead (legacy package) |
| Operating Principle | — | Capacitive micromachined (MEMS) |