MMA6262QR2 vs MMA6263QR2 Comparação
Comparação detalhada lado a lado de MMA6262QR2 por NXP Semiconductors e MMA6263QR2 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Última compraComparação de especificações
| Parâmetro | MMA6262QR2 | MMA6263QR2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Motion Sensors | Motion Sensors |
| Status do ciclo de vida | Última compra | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5,20 | $5,45 |
| Tipo de sensor | Accelerometer, Dual-Axis (X, Y) | Accelerometer, Dual Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g (g-select to ±6 g) |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | — |
| Tipo de saída | Analog, Ratiometric | Analog, ratiometric voltage |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | On-chip factory trimmed |
| Temperatura de operação | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | — |
| Encapsulamento / Caixa | 16-QFN-EP (6x6 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Status RoHS | RoHS3 Compliant | RoHS Compliant |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Tensão de alimentação | — | 3.3 V nominal (range per datasheet) |
| Bandwidth | — | 900 Hz sensor bandwidth |
| Low-Pass Filter | — | 1-pole on-chip, ~400 Hz cutoff |
| Zero-g Output (Typ) | — | 1.65 V (mid-supply) |
| Self-Test | — | Logic-level input on each axis |
| Encapsulamento | — | 16-QFN-EP (6x6 mm) with exposed pad |
| Lead Status | — | Contains Lead (legacy package) |
| Operating Principle | — | Capacitive micromachined (MEMS) |