MPC852TZT80A vs MPC852TVR80A Comparison
Detailed side-by-side comparison of MPC852TZT80A by NXP Semiconductors and MPC852TVR80A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC852TZT80A | MPC852TVR80A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $29.95 | $17.85 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core | MPC8xx (32-bit Power Architecture) | Power Architecture, 32-bit, 1 core |
| Core Count | 1 | — |
| Core Frequency | 80 MHz | 80 MHz |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage | 3.3 V | 3.3 V core with 5 V-tolerant I/O option |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C |
| Package Type | 256-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 23 x 23 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Tray Packaging | Tray (per distributor listing) | — |
| Product Category | Microprocessors (MPU) | — |
| RoHS Status | Non-Compliant (legacy part) | Details not published - verify per lot |
| Lead Finish | Contains lead (SnPb or lead-bearing solder profile) | — |
| Series / Family | — | MPC8xx / PowerQUICC I |
| Package | — | 256-PBGA (23x23 mm, 1.27 mm pitch) |
| Instruction/Data Cache | — | 8 KB unified |
| Communications Module | — | CPM (Communications Processor Module) with HDLC/Ethernet |
| Ethernet Support | — | Up to 3x Fast Ethernet (10/100) |
| PCI Bridge | — | Integrated PCI bridge |
| MSL Level | — | 3 (168 hours) |
| HTSUS Code | — | 8542.31.0001 |