MPC852TZT80A vs MPC852TVR80A Comparación
Comparación detallada lado a lado de MPC852TZT80A por NXP Semiconductors y MPC852TVR80A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC852TZT80A | MPC852TVR80A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $29,95 | $17,85 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core | MPC8xx (32-bit Power Architecture) | Power Architecture, 32-bit, 1 core |
| Core Count | 1 | — |
| Core Frequency | 80 MHz | 80 MHz |
| Process Technology | 0.18 µm CMOS | — |
| Tensión de alimentación | 3.3 V | 3.3 V core with 5 V-tolerant I/O option |
| Temperatura de funcionamiento | 0 °C to +95 °C | 0 °C to +95 °C |
| Package Type | 256-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 23 x 23 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Tray Packaging | Tray (per distributor listing) | — |
| Product Category | Microprocessors (MPU) | — |
| Estado RoHS | Non-Compliant (legacy part) | Details not published - verify per lot |
| Lead Finish | Contains lead (SnPb or lead-bearing solder profile) | — |
| Series / Family | — | MPC8xx / PowerQUICC I |
| Encapsulado | — | 256-PBGA (23x23 mm, 1.27 mm pitch) |
| Instruction/Data Cache | — | 8 KB unified |
| Communications Module | — | CPM (Communications Processor Module) with HDLC/Ethernet |
| Ethernet Support | — | Up to 3x Fast Ethernet (10/100) |
| PCI Bridge | — | Integrated PCI bridge |
| Nivel MSL | — | 3 (168 hours) |
| HTSUS Code | — | 8542.31.0001 |