MPC852TZT80A vs MPC852TVR80A Comparaison
Comparaison détaillée côte à côte de MPC852TZT80A par NXP Semiconductors et MPC852TVR80A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC852TZT80A | MPC852TVR80A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $29,95 | $17,85 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core | MPC8xx (32-bit Power Architecture) | Power Architecture, 32-bit, 1 core |
| Core Count | 1 | — |
| Core Frequency | 80 MHz | 80 MHz |
| Process Technology | 0.18 µm CMOS | — |
| Tension d'alimentation | 3.3 V | 3.3 V core with 5 V-tolerant I/O option |
| Température de fonctionnement | 0 °C to +95 °C | 0 °C to +95 °C |
| Package Type | 256-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 23 x 23 mm | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Tray Packaging | Tray (per distributor listing) | — |
| Product Category | Microprocessors (MPU) | — |
| Statut RoHS | Non-Compliant (legacy part) | Details not published - verify per lot |
| Lead Finish | Contains lead (SnPb or lead-bearing solder profile) | — |
| Series / Family | — | MPC8xx / PowerQUICC I |
| Boîtier | — | 256-PBGA (23x23 mm, 1.27 mm pitch) |
| Instruction/Data Cache | — | 8 KB unified |
| Communications Module | — | CPM (Communications Processor Module) with HDLC/Ethernet |
| Ethernet Support | — | Up to 3x Fast Ethernet (10/100) |
| PCI Bridge | — | Integrated PCI bridge |
| Niveau MSL | — | 3 (168 hours) |
| HTSUS Code | — | 8542.31.0001 |