MPC8543VTANGD vs MPC8547EVTATGD Comparison

Detailed side-by-side comparison of MPC8543VTANGD by NXP Semiconductors and MPC8547EVTATGD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Active
NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete

Specification Comparison

Parameter MPC8543VTANGD MPC8547EVTATGD
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $152.00 $98.50
Manufacturer NXP Semiconductors (Freescale) —
Series PowerQUICC III MPC85xx (PowerQUICC III)
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Architecture Power Architecture, 7-stage pipeline, dual-issue superscalar —
Core Speed 800 MHz —
Bus Width 32-bit —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB [DATA_NEEDED: confirm from datasheet]
Memory Controller DDR2 SDRAM with ECC, up to 533 MHz data rate —
Ethernet MACs 4x Gigabit (SGMII/RGMII) —
PCI Express 2x PCIe interfaces —
Serial RapidIO 2x SRIO endpoints —
PCI/PCI-X 1x 32-bit PCI/PCI-X interface —
Operating Temperature 0 °C to +105 °C 0C to +105C (industrial grade per -TGD suffix)
Core Voltage 1.0 V (typical) 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table]
I/O Voltages 1.8 V / 2.5 V / 3.3 V 1.8V / 2.5V / 3.3V
Process Technology 90 nm CMOS 0.09 um CMOS
Package Type FCBGA-783 (29x29 mm) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] Compliant [DATA_NEEDED: confirm via NXP product page]
Core Width — 32-Bit
Core Frequency — 1.2 GHz
Co-Processors / DSP — Signal Processing Engine (SPE); Security Engine (SEC 3.x)
L1 Cache (I/D) — 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table]
RAM Controllers — DDR, DDR2, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — None integrated
Ethernet — 4 x 10/100/1000 Mbps (GigE)
PCI / PCIe / SRIO — PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO
Other I/O — Local bus, I2C, DUART, GPIO, USB 2.0, SPI
Operating Temperature Range per DigiKey — -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm]
Package / Case — 783-BBGA, FCBGA (29 x 29 mm)
Part Status — Obsolete

Datasheets & Resources

Browse All Products Create BOM Request Quote