MPC8543VTANGD vs MPC8547EVTATGD Comparaison

Comparaison détaillée côte à côte de MPC8543VTANGD par NXP Semiconductors et MPC8547EVTATGD par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Actif
NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete

Comparaison des spécifications

Paramètre MPC8543VTANGD MPC8547EVTATGD
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Actif Obsolete
Statut du stock In Stock In Stock
Prix unitaire (USD) $152,00 $98,50
Manufacturer NXP Semiconductors (Freescale) —
Series PowerQUICC III MPC85xx (PowerQUICC III)
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Architecture Power Architecture, 7-stage pipeline, dual-issue superscalar —
Core Speed 800 MHz —
Bus Width 32-bit —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB [DATA_NEEDED: confirm from datasheet]
Memory Controller DDR2 SDRAM with ECC, up to 533 MHz data rate —
Ethernet MACs 4x Gigabit (SGMII/RGMII) —
PCI Express 2x PCIe interfaces —
Serial RapidIO 2x SRIO endpoints —
PCI/PCI-X 1x 32-bit PCI/PCI-X interface —
Température de fonctionnement 0 °C to +105 °C 0C to +105C (industrial grade per -TGD suffix)
Core Voltage 1.0 V (typical) 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table]
I/O Voltages 1.8 V / 2.5 V / 3.3 V 1.8V / 2.5V / 3.3V
Process Technology 90 nm CMOS 0.09 um CMOS
Package Type FCBGA-783 (29x29 mm) —
Type de montage Surface Mount (BGA) Surface Mount
Statut RoHS [DATA_NEEDED: RoHS status] Compliant [DATA_NEEDED: confirm via NXP product page]
Core Width — 32-Bit
Core Frequency — 1.2 GHz
Co-Processors / DSP — Signal Processing Engine (SPE); Security Engine (SEC 3.x)
L1 Cache (I/D) — 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table]
RAM Controllers — DDR, DDR2, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — None integrated
Ethernet — 4 x 10/100/1000 Mbps (GigE)
PCI / PCIe / SRIO — PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO
Other I/O — Local bus, I2C, DUART, GPIO, USB 2.0, SPI
Operating Temperature Range per DigiKey — -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm]
Boîtier / Format — 783-BBGA, FCBGA (29 x 29 mm)
Part Status — Obsolete

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