MPC8543VTANGD vs MPC8547EVTATGD Comparação

Comparação detalhada lado a lado de MPC8543VTANGD por NXP Semiconductors e MPC8547EVTATGD por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ Ativo
NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete

Comparação de especificações

Parâmetro MPC8543VTANGD MPC8547EVTATGD
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $152,00 $98,50
Manufacturer NXP Semiconductors (Freescale) —
Series PowerQUICC III MPC85xx (PowerQUICC III)
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Architecture Power Architecture, 7-stage pipeline, dual-issue superscalar —
Core Speed 800 MHz —
Bus Width 32-bit —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB [DATA_NEEDED: confirm from datasheet]
Memory Controller DDR2 SDRAM with ECC, up to 533 MHz data rate —
Ethernet MACs 4x Gigabit (SGMII/RGMII) —
PCI Express 2x PCIe interfaces —
Serial RapidIO 2x SRIO endpoints —
PCI/PCI-X 1x 32-bit PCI/PCI-X interface —
Temperatura de operação 0 °C to +105 °C 0C to +105C (industrial grade per -TGD suffix)
Core Voltage 1.0 V (typical) 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table]
I/O Voltages 1.8 V / 2.5 V / 3.3 V 1.8V / 2.5V / 3.3V
Process Technology 90 nm CMOS 0.09 um CMOS
Package Type FCBGA-783 (29x29 mm) —
Tipo de montagem Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: RoHS status] Compliant [DATA_NEEDED: confirm via NXP product page]
Core Width — 32-Bit
Core Frequency — 1.2 GHz
Co-Processors / DSP — Signal Processing Engine (SPE); Security Engine (SEC 3.x)
L1 Cache (I/D) — 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table]
RAM Controllers — DDR, DDR2, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — None integrated
Ethernet — 4 x 10/100/1000 Mbps (GigE)
PCI / PCIe / SRIO — PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO
Other I/O — Local bus, I2C, DUART, GPIO, USB 2.0, SPI
Operating Temperature Range per DigiKey — -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm]
Encapsulamento / Caixa — 783-BBGA, FCBGA (29 x 29 mm)
Part Status — Obsolete

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