MPC855TZQ50D4 vs MPC860DEZQ50D4 Comparison
Detailed side-by-side comparison of MPC855TZQ50D4 by NXP Semiconductors and MPC860DEZQ50D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC855TZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $19.50 | $24.95 |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | Yes |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Package | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| Operating Temperature | 0C to +95C | 0 C to +95 C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS status] | Contains Lead (legacy BGA) |
| Supply Voltage | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |