MPC855TZQ50D4 vs MPC860DEZQ50D4 对比
详细并排对比 MPC855TZQ50D4 出自 NXP Semiconductors 和 MPC860DEZQ50D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC855TZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $19.50 | $24.95 |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | Yes |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| 封装 | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| 工作温度 | 0C to +95C | 0 C to +95 C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Contains Lead (legacy BGA) |
| 电源电压 | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |