MPC8569EVTANKGB vs MPC8555EVTAPF Comparison

Detailed side-by-side comparison of MPC8569EVTANKGB by NXP Semiconductors and MPC8555EVTAPF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8569EVTANKGB MPC8569EVTANKGB - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP

MPC8569EVTANKGB - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP

MPC8569EVTANKGB Nrnd
NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ Last Time Buy

Specification Comparison

Parameter MPC8569EVTANKGB MPC8555EVTAPF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Last Time Buy
Part Status Obsolete / NRND —
Core Processor PowerPC e500v2 —
Number of Cores 1 —
Core Bus Width 32-bit —
Speed (Operating Frequency) 800 MHz —
Series MPC85xx (PowerQUICC III) PowerQUICC III (MPC85xx)
Co-Processors / DSP QUICC Engine + Security (SEC) —
Graphics Acceleration No —
RAM Controllers DDR2 / DDR3 / SDRAM with ECC —
Display & Interface Controllers [DATA_NEEDED: specific display/interface controller block name] —
Ethernet Multiple 10/100/1000 MACs (Three-Speed) 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI)
USB [DATA_NEEDED: USB version and channel count] —
Operating Supply Voltage 1.0 V core; 1.5 V / 1.8 V / 2.5 V / 3.3 V I/O —
Package Type 783-ball FCBGA (Flip-Chip BGA) —
Package Dimensions 29 mm x 29 mm, 1 mm ball pitch —
Operating Temperature 0C to 105C (commercial) / -40C to 85C (industrial) -40C to +105C (industrial extended)
Mounting Type Surface Mount Surface Mount
Process Technology 90 nm CMOS —
MIPS Performance 1675 MIPS at 800 MHz (Dhrystone 2.1) —
RoHS Status Compliant per NXP product page Compliant
Core Architecture — PowerPC e500
Core Count — 1
Data Bus Width — 32 bit
Maximum Clock Frequency — 833 MHz
Package — 783-FCPBGA (29 x 29 mm)
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 256 KB integrated
Memory Controller — 32-bit DDR with ECC, up to DDR-333
PCI Interface — 2 x PCI 2.2 (32-bit, 66 MHz)
Security Engine — IPSec / SSL / TLS / bulk crypto acceleration
Supply Voltage — 1.0 V core, 3.3 V I/O (typical)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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