MPC8569EVTANKGB vs MPC8555EVTAPF Vergleich
Detaillierter Direktvergleich von MPC8569EVTANKGB von NXP Semiconductors und MPC8555EVTAPF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP
MPC8555EVTAPF ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8569EVTANKGB | MPC8555EVTAPF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Part Status | Obsolete / NRND | — |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | — |
| Core Bus Width | 32-bit | — |
| Speed (Operating Frequency) | 800 MHz | — |
| Series | MPC85xx (PowerQUICC III) | PowerQUICC III (MPC85xx) |
| Co-Processors / DSP | QUICC Engine + Security (SEC) | — |
| Graphics Acceleration | No | — |
| RAM Controllers | DDR2 / DDR3 / SDRAM with ECC | — |
| Display & Interface Controllers | [DATA_NEEDED: specific display/interface controller block name] | — |
| Ethernet | Multiple 10/100/1000 MACs (Three-Speed) | 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI) |
| USB | [DATA_NEEDED: USB version and channel count] | — |
| Betriebsversorgungsspannung | 1.0 V core; 1.5 V / 1.8 V / 2.5 V / 3.3 V I/O | — |
| Package Type | 783-ball FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm, 1 mm ball pitch | — |
| Betriebstemperatur | 0C to 105C (commercial) / -40C to 85C (industrial) | -40C to +105C (industrial extended) |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | — |
| MIPS Performance | 1675 MIPS at 800 MHz (Dhrystone 2.1) | — |
| RoHS-Status | Compliant per NXP product page | Compliant |
| Core Architecture | — | PowerPC e500 |
| Core Count | — | 1 |
| Datenbusbreite | — | 32 bit |
| Maximale Taktfrequenz | — | 833 MHz |
| Gehäuse | — | 783-FCPBGA (29 x 29 mm) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 256 KB integrated |
| Memory Controller | — | 32-bit DDR with ECC, up to DDR-333 |
| PCI Interface | — | 2 x PCI 2.2 (32-bit, 66 MHz) |
| Security Engine | — | IPSec / SSL / TLS / bulk crypto acceleration |
| Versorgungsspannung | — | 1.0 V core, 3.3 V I/O (typical) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |