MPC8572EPXAVND vs MPC8572ECPXAVND Comparison
Detailed side-by-side comparison of MPC8572EPXAVND by NXP Semiconductors and MPC8572ECPXAVND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP
MPC8572ECPXAVND ✓ ActiveSpecification Comparison
| Parameter | MPC8572EPXAVND | MPC8572ECPXAVND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $191.67 | $365.00 |
| Core Processor | PowerPC e500 | PowerPC e500 |
| Number of Cores | 2 | 2 |
| Data Bus Width | 32-bit | — |
| Maximum Core Frequency | 1.5 GHz | — |
| Co-Processors / DSP | SPE (Signal Processing Engine), SEC (Security Engine) | — |
| Series | MPC85xx (PowerQUICC III) | MPC85xx (PowerQUICC III) |
| RAM Controllers | DDR2, DDR3 (with ECC) | — |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | — |
| PCI Express | 4 lanes / 2 controllers | — |
| Serial RapidIO | 2 interfaces | — |
| UART | DUART (2 channels) | — |
| Graphics Acceleration | No | — |
| Operating Supply Voltage | 1.1 V (core), 1.8 V / 2.5 V / 3.3 V (I/O) | — |
| Package | 1023-ball FCBGA (33 x 33 mm) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Temperature | -40C to +105C (industrial grade) | -40C to +105C (Extended Temp, AVND suffix) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Manufacturer | — | NXP USA Inc. |
| Core Architecture | — | 32-Bit |
| Maximum CPU Clock | — | 1.5 GHz |
| Package / Case | — | 1023-BFBGA, FCBGA (33x33 mm) |
| Memory Controller | — | DDR2/DDR3 with ECC (per datasheet) |
| Ethernet Interfaces | — | Multiple Gigabit Ethernet (per datasheet) |
| High-Speed Serial | — | PCI Express and/or Serial RapidIO SerDes (per datasheet) |
| Hardware Acceleration | — | QUICC Engine, security acceleration (per datasheet) |
| Packaging | — | Tray |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |