MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP
MPN: MPC8572EPXAVND ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $319.46 | $319.46 |
| 10 | $287.51 | $2,875.10 |
| 100 | $255.57 | $25,557.00 |
| 500 | $223.62 | $111,810.00 |
| 1,000 | $191.67 | $191,670.00 |
MPC8572EPXAVND Overview
A microprocessor (MPU) is a single-chip CPU central processing unit integrating control unit, ALU, registers, and often caches and peripherals on one die. The PowerQUICC III family sits in NXP's communications-processor hierarchy: PowerPC e500 core -> MPC85xx architecture -> PowerQUICC family -> communications processors -> embedded MPUs. The e500 core is a 32-bit Book-E implementation tuned for low-latency deterministic control and networking workloads rather than general-purpose compute.
Key features include dual 32-bit PowerPC e500 cores, integrated SPE (Signal Processing Engine) and SEC (Security Engine) co-processors, three Enhanced Three-Speed Ethernet (eTSEC) controllers supporting 10/100/1000 Mbps, a DDR2/DDR3 SDRAM memory controller, four PCI Express interfaces, two serial RapidIO interfaces, a DUART, and flexible I/O multiplexing. The 1023-FCBGA package exposes the full pin complement required for these high-bandwidth peripherals.
The architecture uses a coherent SMP fabric between the two e500 cores, allowing symmetric multi-processing for control-plane tasks. The SEC engine accelerates DES, 3DES, AES, SHA-1/2, and Kasumi, while the SPE offloads DSP-style operations on packet payloads. The DDR2/DDR3 controller with ECC supports registered DIMMs at speeds up to 800 MHz data rate, giving the platform enough memory bandwidth for stateful firewall and routing tables.
Typical applications include enterprise routers, multi-service switches, line cards, IP-PBX systems, and secure VPN gateways. The dual cores plus security accelerators make it well suited to combined control-plane + data-plane + encryption workloads on a single SoC.
When designing in the MPC8572EPXAVND, allocate adequate PCB layers (typically 8+ with dedicated power planes) for the 1.5 GHz core and DDR memory. Place decoupling capacitors within 5 mm of every power pin and route the DDR differential clocks with controlled impedance. Verify thermal design against the worst-case industrial junction temperature.
This page consolidates distributor pricing, same-family drop-in variants, and engineering design notes beyond the manufacturer marketing summary to accelerate your evaluation.
Drop-in alternatives for MPC8572EPXAVND — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8572EPXAVND (same form factor and footprint) — differing in Operating Temperature, Manufacturer, Memory Controller, Mounting Type, Core Processor.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8572ECPXAVND
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →MPC8572EVTAVND
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8572ELVTAVND
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →MPC8572EPXARLC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8572EPXATLD
✅ Drop-In✓ In Stock
$218.5 / Unit
View Datasheet →MPC8572EPXAVND Maximum Ratings & Electrical Characteristics
| Core Processor | PowerPC e500 |
| Number of Cores | 2 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 1.5 GHz |
| Co-Processors / DSP | SPE (Signal Processing Engine), SEC (Security Engine) |
| Series | MPC85xx (PowerQUICC III) |
| RAM Controllers | DDR2, DDR3 (with ECC) |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) |
| PCI Express | 4 lanes / 2 controllers |
| Serial RapidIO | 2 interfaces |
| UART | DUART (2 channels) |
| Graphics Acceleration | No |
| Operating Supply Voltage | 1.1 V (core), 1.8 V / 2.5 V / 3.3 V (I/O) |
| Package | 1023-ball FCBGA (33 x 33 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +105C (industrial grade) |
MPC8572EPXAVND 1023-ball fcbga (33 x 33 mm) Pin Configuration Guide
Pin configuration for MPC8572EPXAVND (1023-ball fcbga (33 x 33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8572EPXAVND.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8572EPXAVND is suitable for 6 applications: Enterprise Edge Router, Multi-Service Switching Line Card, IP-PBX and Unified Communications Gateway, Industrial Firewall and VPN Appliance, Wireless Backhaul Aggregation Platform, Secure Storage Controller and NAS Appliance.
Enterprise Edge Router
The MPC8572EPXAVND fits enterprise edge routers because its dual 1.5 GHz PowerPC e500 cores deliver deterministic routing throughput while the three eTSEC controllers aggregate multiple Gigabit uplinks. The integrated SEC engine accelerates IPSec and SSL/TLS for site-to-site VPN termination at line rate without burdening the cores. The DDR2/DDR3 controller with ECC maintains stateful firewall and routing tables reliably at the upper industrial temperature ceiling. NXP reference designs recommend pairing it with a SerDes-based Gigabit PHY and an external TCAM for OSPF/BGP adjacency handling.
Recommended
Multi-Service Switching Line Card
In multi-service switching line cards, the MPC8572EPXAVND acts as the control-plane processor with 4 PCI Express lanes providing chip-to-chip interconnect to a switch fabric ASIC. The 2 Serial RapidIO interfaces offer an alternative deterministic backplane for telecom deployments where latency must be tightly bounded. The 1 MB shared L2 cache keeps control-plane memory transactions local, reducing DDR bandwidth pressure. Designers pair it with a fabric companion such as NXP's P2020 or a third-party TDM mapper to aggregate T1/E1 and Ethernet traffic on a single line card.
Recommended
IP-PBX and Unified Communications Gateway
The MPC8572EPXAVND fits IP-PBX and unified communications gateways because the dual e500 cores handle call-control signaling and RTP media paths in parallel, while the SPE offloads voice/video codecs from the cores. The SEC engine secures SIP/TLS and SRTP media streams without CPU intervention, preserving call capacity. With three Gigabit Ethernet controllers the gateway can segment management, voice VLAN, and WAN uplink traffic physically. A reference IP-PBX design typically pairs it with a TDM circuit emulation IC for legacy PSTN connectivity and a DSP farm for transcoding.
Recommended
Industrial Firewall and VPN Appliance
The MPC8572EPXAVND powers industrial firewall and VPN appliances where the SEC engine's AES-256/SHA-256 throughput sustains multi-gigabit IPSec tunnels for SCADA backhaul. The industrial -40C to +105C temperature grade permits deployment in factory floor enclosures without active cooling. DDR2/DDR3 with ECC guards configuration memory against soft errors in electrically noisy industrial environments. Application notes from NXP document pairing the part with hardware random-number generators and secure-boot supervisors for FIPS-compliant deployments.
Recommended
Wireless Backhaul Aggregation Platform
Wireless backhaul aggregation platforms leverage the MPC8572EPXAVND to terminate multiple T1/E1 and Ethernet pseudowires while the Serial RapidIO ports provide deterministic low-latency links to baseband modems. The dual cores separate management-plane OAM from data-plane pseudowire forwarding for predictable jitter. The 1.5 GHz clock budget provides headroom for shaping, policing, and QoS queues per pseudowire. Reference designs combine the processor with a Timing-over-Packet/SyncEtagger IC and an external SATA controller for logging.
Recommended
Secure Storage Controller and NAS Appliance
The MPC8572EPXAVND is suitable for secure storage controllers because the SEC engine accelerates AES-XTS full-disk encryption without throughput loss on RAID rebuild operations. The PCI Express lanes connect to multi-port SAS/SATA controllers for 8+ drive bays, while the eTSEC controllers handle GbE management and data ports. ECC-protected DDR memory ensures metadata consistency during unexpected power-loss events. NXP's reference design pairs it with an external BMC for IPMI and a hardware RNG for cryptographic key generation.
Recommended
Recommended Products Summary
Engineering reference data for MPC8572EPXAVND — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8572ECPXAVND | MPC8572EVTAVND | MPC8572ELVTAVND | MPC8572EPXARLC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Architecture | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 |
| Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz (or per suffix) | 1.5 GHz (LV variant) | 1.5 GHz |
| Co-Processors | SPE + SEC | SPE + SEC | SPE + SEC | SPE + SEC | SPE + SEC |
| Temperature Grade | -40C to +105C (industrial) | -40C to +85C (extended) | Per suffix decoder | Per suffix decoder | Per suffix decoder |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet Controllers | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) |
| PCI Express | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher industrial temperature ceiling than the CPXAVND variant (vs MPC8572ECPXAVND)
- Same 1.5 GHz maximum frequency with potentially tighter voltage tuning (vs MPC8572EVTAVND)
- Integrated SEC engine for hardware-accelerated cryptography (vs MPC8572EPXARLC)
- Standalone LV variant offers lower core voltage for power-sensitive designs (vs MPC8572ELVTAVND)
Design Notes
The 1023-ball FCBGA package at 1.5 GHz requires a minimum 8-layer PCB stack-up with continuous ground and power planes beneath the BGA. Use micro-via-in-pad technology if escape density demands it, and follow NXP's BGA escape routing recommendations in the hardware specifications document. Route DDR2/DDR3 signals with 50-ohm single-ended impedance and match length within 25 mils across byte lanes to maintain signal integrity at the 800 MHz data rate.
At 1.5 GHz with all peripherals active, the MPC8572EPXAVND dissipates several watts into the FCBGA. For closed industrial enclosures, attach a heat spreader or heatsink to the top of the package and verify junction temperature against the 105C limit using the NXP-supplied thermal model. Forced airflow (typically 1-2 m/s) is recommended for fanless designs to keep junction rise under 40C above ambient.
The MPC8572EPXAVND requires four supply rails (1.1 V core, 1.8 V DDR, 2.5 V, 3.3 V I/O) with strict sequencing and ramp-rate requirements per the hardware specifications document. Place bulk decoupling within 10 mm of the BGA and 0.1 uF ceramic capacitors within 5 mm of every power pin. Use a multi-rail PMIC with programmable soft-start to enforce the correct power-up sequence and prevent latch-up during brownout events.
The eTSEC, Serial RapidIO, and PCI Express interfaces are high-speed SerDes links requiring controlled-impedance routing and tight length matching. Use the NXP IBIS-AMI models for simulation and follow the reference design's via pattern to maintain 85-100 ohm differential impedance. Add AC-coupling capacitors on each SerDes lane near the transmitter as required by the protocol, and verify eye diagrams at the receiver with compliance patterns.
Do not assume all MPC8572E suffix variants share identical voltage and temperature ratings - decode the suffix against the NXP part-number guide before substituting on existing boards. Verify the DDR memory topology matches the configured data rate (800 MT/s) in U-Boot or your RCW (Reset Configuration Word). When migrating from prototype to production, validate the JTAG boundary-scan BSDL against your final assembly to catch shorts and opens.
Compliance Information
Compliance status not present in the verified distributor data; RoHS, REACH, lead-free, and halogen-free fields are marked unknown per Data Authenticity Rule 1. AEC-Q100 is not applicable because this is a communications MPU rather than an automotive-grade IC. Designers should request the NXP material declaration directly for the exact compliance certificate.
