MPC8572VTAVNE vs MPC8572ELVTAVND Comparison
Detailed side-by-side comparison of MPC8572VTAVNE by NXP Semiconductors and MPC8572ELVTAVND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE ✓ ActiveNXP Semiconductors
MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND ✓ ActiveSpecification Comparison
| Parameter | MPC8572VTAVNE | MPC8572ELVTAVND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $308.00 | $198.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) | PowerPC e500, dual-core |
| Number of Cores | 2 | — |
| Core Clock Frequency (max) | 1.5 GHz | — |
| Operating Temperature Range | 0 C to +105 C | — |
| Core Voltage | 1.1 V | — |
| L2 Cache | 1 MB (shared) | 1 MB shared |
| Memory Controller | DDR2 / DDR3 with ECC | Dual DDR2 with ECC |
| PCI Express | 3 x PCIe interfaces | — |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) | — |
| Serial RapidIO | Yes | — |
| Security Engine | Integrated | AES, DES, 3DES, Kasumi, SHA-1/256 |
| Package | 1023-ball FCBGA, 33 mm x 33 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL classification] | — |
| RoHS Status | compliant | — |
| Product Family | PowerQUICC III (MPC85xx) | — |
| Process Node | [DATA_NEEDED: fabrication process] | — |
| Part Family | — | PowerQUICC III MPC85xx |
| Data Bus Width | — | 32-bit |
| Maximum Clock Speed | — | 1.5 GHz |
| Operating Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um (90 nm) CMOS |
| Package / Case | — | 1023-FCBGA (33x33 mm) |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| Ethernet | — | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | — | PCI Express x8, Serial RapidIO |
| Operating Temperature | — | 0C to +85C (commercial) |
| Compliance | — | RoHS status [DATA_NEEDED: rohs status] |