MPC8572VTAVNE vs MPC8572ELVTAVND Comparaison
Comparaison détaillée côte à côte de MPC8572VTAVNE par NXP Semiconductors et MPC8572ELVTAVND par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE ✓ ActifNXP Semiconductors
MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND ✓ ActifComparaison des spécifications
| Paramètre | MPC8572VTAVNE | MPC8572ELVTAVND |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $308,00 | $198,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) | PowerPC e500, dual-core |
| Number of Cores | 2 | — |
| Core Clock Frequency (max) | 1.5 GHz | — |
| Plage de température de fonctionnement | 0 C to +105 C | — |
| Core Voltage | 1.1 V | — |
| L2 Cache | 1 MB (shared) | 1 MB shared |
| Memory Controller | DDR2 / DDR3 with ECC | Dual DDR2 with ECC |
| PCI Express | 3 x PCIe interfaces | — |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) | — |
| Serial RapidIO | Yes | — |
| Security Engine | Integrated | AES, DES, 3DES, Kasumi, SHA-1/256 |
| Boîtier | 1023-ball FCBGA, 33 mm x 33 mm | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL classification] | — |
| Statut RoHS | compliant | — |
| Product Family | PowerQUICC III (MPC85xx) | — |
| Process Node | [DATA_NEEDED: fabrication process] | — |
| Part Family | — | PowerQUICC III MPC85xx |
| Largeur du bus de données | — | 32-bit |
| Maximum Clock Speed | — | 1.5 GHz |
| Operating Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um (90 nm) CMOS |
| Boîtier / Format | — | 1023-FCBGA (33x33 mm) |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| Ethernet | — | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | — | PCI Express x8, Serial RapidIO |
| Température de fonctionnement | — | 0C to +85C (commercial) |
| Compliance | — | RoHS status [DATA_NEEDED: rohs status] |