MPC8572VTAVNE vs MPC8572ELVTAVND Comparación
Comparación detallada lado a lado de MPC8572VTAVNE por NXP Semiconductors y MPC8572ELVTAVND por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE ✓ ActivoNXP Semiconductors
MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND ✓ ActivoComparación de especificaciones
| Parámetro | MPC8572VTAVNE | MPC8572ELVTAVND |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $308,00 | $198,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) | PowerPC e500, dual-core |
| Number of Cores | 2 | — |
| Core Clock Frequency (max) | 1.5 GHz | — |
| Rango de temperatura de funcionamiento | 0 C to +105 C | — |
| Core Voltage | 1.1 V | — |
| L2 Cache | 1 MB (shared) | 1 MB shared |
| Memory Controller | DDR2 / DDR3 with ECC | Dual DDR2 with ECC |
| PCI Express | 3 x PCIe interfaces | — |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) | — |
| Serial RapidIO | Yes | — |
| Security Engine | Integrated | AES, DES, 3DES, Kasumi, SHA-1/256 |
| Encapsulado | 1023-ball FCBGA, 33 mm x 33 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL classification] | — |
| Estado RoHS | compliant | — |
| Product Family | PowerQUICC III (MPC85xx) | — |
| Process Node | [DATA_NEEDED: fabrication process] | — |
| Part Family | — | PowerQUICC III MPC85xx |
| Ancho del bus de datos | — | 32-bit |
| Maximum Clock Speed | — | 1.5 GHz |
| Operating Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um (90 nm) CMOS |
| Encapsulado / Carcasa | — | 1023-FCBGA (33x33 mm) |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| Ethernet | — | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | — | PCI Express x8, Serial RapidIO |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Compliance | — | RoHS status [DATA_NEEDED: rohs status] |