MPC859DSLZP66A vs MPC859DSLZP50A Comparison
Detailed side-by-side comparison of MPC859DSLZP66A by NXP Semiconductors and MPC859DSLZP50A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357
MPC859DSLZP50A ✗ End of LifeSpecification Comparison
| Parameter | MPC859DSLZP66A | MPC859DSLZP50A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $125.40 | $52.50 |
| Core | PowerPC 32-bit (MPC8xx family) | — |
| Core Frequency | 66 MHz | 50 MHz |
| Architecture | Harvard, MMU + FPU | — |
| Cache | 4 KB I-cache + 4 KB D-cache (configurable) | — |
| Communications Processor Module (CPM) | QUICC engine, dual 10/100 Ethernet MAC, HDLC, UART, I2C | — |
| Instruction Set | PowerPC (UISA + VEA) | — |
| Data Bus Width | 32-bit (64-bit external memory bus) | — |
| Address Bus Width | 32-bit | — |
| Supply Voltage (Core/IO) | 3.3 V | — |
| Operating Temperature | 0C to +70C (commercial); -40C to +85C (industrial - screened variant) | 0 C to +95 C |
| Package | 357-ball PBGA, 25 x 25 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Compliant per NXP product page (suffix 'A' is Pb-free) | — |
| Number of Terminals | 357 | — |
| Series | MPC8xx PowerQUICC | — |
| Silicon Revision | Rev A | — |
| Processor Type | — | MPC8xx PowerQUICC Integrated Communications Controller |
| Core Architecture | — | 32-bit Power Architecture |
| Number of Cores | — | 1 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Package / Case | — | 357-PBGA (25x25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| RoHS Status | — | RoHS |
| Ethernet MACs | — | 2 x 10/100 Mbps |
| Process Technology | — | 0.18 micron CMOS |
| Lifecycle | — | End of Life per NXP product page |