MPC859DSLZP66A vs MPC859DSLZP50A Vergleich
Detaillierter Direktvergleich von MPC859DSLZP66A von NXP Semiconductors und MPC859DSLZP50A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357
MPC859DSLZP50A ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC859DSLZP66A | MPC859DSLZP50A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $125,40 | $52,50 |
| Core | PowerPC 32-bit (MPC8xx family) | — |
| Core Frequency | 66 MHz | 50 MHz |
| Architecture | Harvard, MMU + FPU | — |
| Cache | 4 KB I-cache + 4 KB D-cache (configurable) | — |
| Communications Processor Module (CPM) | QUICC engine, dual 10/100 Ethernet MAC, HDLC, UART, I2C | — |
| Instruction Set | PowerPC (UISA + VEA) | — |
| Datenbusbreite | 32-bit (64-bit external memory bus) | — |
| Address Bus Width | 32-bit | — |
| Supply Voltage (Core/IO) | 3.3 V | — |
| Betriebstemperatur | 0C to +70C (commercial); -40C to +85C (industrial - screened variant) | 0 C to +95 C |
| Gehäuse | 357-ball PBGA, 25 x 25 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Compliant per NXP product page (suffix 'A' is Pb-free) | — |
| Number of Terminals | 357 | — |
| Series | MPC8xx PowerQUICC | — |
| Silicon Revision | Rev A | — |
| Processor Type | — | MPC8xx PowerQUICC Integrated Communications Controller |
| Core Architecture | — | 32-bit Power Architecture |
| Number of Cores | — | 1 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Gehäuse / Bauform | — | 357-PBGA (25x25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| RoHS-Status | — | RoHS |
| Ethernet MACs | — | 2 x 10/100 Mbps |
| Process Technology | — | 0.18 micron CMOS |
| Lifecycle | — | End of Life per NXP product page |