MPC859DSLZP66A vs MPC859DSLZP50A Сравнение
Подробное сравнение бок о бок MPC859DSLZP66A от NXP Semiconductors и MPC859DSLZP50A от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357
MPC859DSLZP50A ✗ Снят с производстваСравнение характеристик
| Параметр | MPC859DSLZP66A | MPC859DSLZP50A |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | NRND | Снято с производства |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $125,40 | $52,50 |
| Core | PowerPC 32-bit (MPC8xx family) | — |
| Core Frequency | 66 MHz | 50 MHz |
| Architecture | Harvard, MMU + FPU | — |
| Cache | 4 KB I-cache + 4 KB D-cache (configurable) | — |
| Communications Processor Module (CPM) | QUICC engine, dual 10/100 Ethernet MAC, HDLC, UART, I2C | — |
| Instruction Set | PowerPC (UISA + VEA) | — |
| Разрядность шины данных | 32-bit (64-bit external memory bus) | — |
| Address Bus Width | 32-bit | — |
| Supply Voltage (Core/IO) | 3.3 V | — |
| Рабочая температура | 0C to +70C (commercial); -40C to +85C (industrial - screened variant) | 0 C to +95 C |
| Корпус | 357-ball PBGA, 25 x 25 mm | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Compliant per NXP product page (suffix 'A' is Pb-free) | — |
| Number of Terminals | 357 | — |
| Series | MPC8xx PowerQUICC | — |
| Silicon Revision | Rev A | — |
| Processor Type | — | MPC8xx PowerQUICC Integrated Communications Controller |
| Core Architecture | — | 32-bit Power Architecture |
| Number of Cores | — | 1 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Корпус / Типоразмер | — | 357-PBGA (25x25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Статус RoHS | — | RoHS |
| Ethernet MACs | — | 2 x 10/100 Mbps |
| Process Technology | — | 0.18 micron CMOS |
| Lifecycle | — | End of Life per NXP product page |