MPC860ENZQ50D4R2518 vs MPC860SRCZQ50D4 Comparison

Detailed side-by-side comparison of MPC860ENZQ50D4R2518 by NXP Semiconductors and MPC860SRCZQ50D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860ENZQ50D4R2518 MPC860ENZQ50D4R2518 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860ENZQ50D4R2518 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860ENZQ50D4R2518 ⚠ Last Time Buy
NXP Semiconductors
MPC860SRCZQ50D4 MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP

MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP

MPC860SRCZQ50D4 ⚠ Last Time Buy

Specification Comparison

Parameter MPC860ENZQ50D4R2518 MPC860SRCZQ50D4
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Last Time Buy
Core Architecture PowerPC PowerPC 32-bit
Core Count 1 1
Data Bus Width 32-bit —
Maximum Core Frequency 50 MHz —
Family MPC8xx (PowerQUICC) —
Communications Module CPM with 4 KDMA channels —
Serial Communication Controllers (SCC) 4 —
Serial Management Controllers (SMC) 2 —
Ethernet MAC Integrated 10/100 (EN feature) —
SPI / I2C 1 / 1 —
Package 357-PBGA, 25 x 25 mm, 1.27 mm pitch 357-PBGA (25x25 mm)
Operating Temperature -40C to +85C (industrial) —
Supply Voltage [DATA_NEEDED: core / I/O voltage] 3.3 V
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status [DATA_NEEDED: RoHS compliance per lot] RoHS status per datasheet
Customer Code Suffix R2518 (per part marking) —
Lead-Free [DATA_NEEDED: lead-free status] —
Processor Family — MPC8xx PowerQUICC
Operating Frequency — 50 MHz
Process Technology — 0.32 µm CMOS
Instruction Cache — 4 KB
Data Cache — 4 KB
Integrated CPM — Yes (QUICC engine, multiple SCCs/SMCs)
External Bus Width — 32-bit
Packaging — Tray
Lead Free Status — Contains Lead
Lifecycle Status — Discontinuance / Last Time Buy per NXP PCN

Datasheets & Resources

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