MPC860ENZQ50D4R2518 vs MPC860SRCZQ50D4 对比

详细并排对比 MPC860ENZQ50D4R2518 出自 NXP Semiconductors 和 MPC860SRCZQ50D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860ENZQ50D4R2518 MPC860ENZQ50D4R2518 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860ENZQ50D4R2518 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860ENZQ50D4R2518 ⚠ 最后一次采购
NXP Semiconductors
MPC860SRCZQ50D4 MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP

MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP

MPC860SRCZQ50D4 ⚠ 最后一次采购

规格对比

参数 MPC860ENZQ50D4R2518 MPC860SRCZQ50D4
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
Core Architecture PowerPC PowerPC 32-bit
Core Count 1 1
数据总线宽度 32-bit —
Maximum Core Frequency 50 MHz —
Family MPC8xx (PowerQUICC) —
Communications Module CPM with 4 KDMA channels —
Serial Communication Controllers (SCC) 4 —
Serial Management Controllers (SMC) 2 —
Ethernet MAC Integrated 10/100 (EN feature) —
SPI / I2C 1 / 1 —
封装 357-PBGA, 25 x 25 mm, 1.27 mm pitch 357-PBGA (25x25 mm)
工作温度 -40C to +85C (industrial) —
电源电压 [DATA_NEEDED: core / I/O voltage] 3.3 V
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] —
RoHS 状态 [DATA_NEEDED: RoHS compliance per lot] RoHS status per datasheet
Customer Code Suffix R2518 (per part marking) —
Lead-Free [DATA_NEEDED: lead-free status] —
Processor Family — MPC8xx PowerQUICC
Operating Frequency — 50 MHz
Process Technology — 0.32 µm CMOS
Instruction Cache — 4 KB
Data Cache — 4 KB
Integrated CPM — Yes (QUICC engine, multiple SCCs/SMCs)
External Bus Width — 32-bit
Packaging — Tray
Lead Free Status — Contains Lead
生命周期状态 — Discontinuance / Last Time Buy per NXP PCN

数据手册与资源

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