MPC860TVR80D4 vs MPC860TVR50D4 Comparison
Detailed side-by-side comparison of MPC860TVR80D4 by NXP Semiconductors and MPC860TVR50D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC860TVR80D4 | MPC860TVR50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.85 | $58.00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | — |
| Operating Voltage | 3.3 V | — |
| Package / Case | 357-BGA (PBGA 25x25 mm) | 357-PBGA (25x25 mm) |
| Process Technology | 0.32 micrometer CMOS | 0.32 µm CMOS |
| Instruction Cache | 4 KB | 4 Kbyte |
| Data Cache | 4 KB | 4 Kbyte |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | DRAM, SRAM, EPROM, Flash |
| Number of Cores | 1 | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: rohs compliance] |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Core Count | — | 1 |
| Maximum Clock Frequency | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Operating Temperature Range | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |