MPC860TVR80D4 vs MPC860TVR50D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR80D4 von NXP Semiconductors und MPC860TVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TVR80D4 | MPC860TVR50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $14,85 | $58,00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | — |
| Operating Voltage | 3.3 V | — |
| Gehäuse / Bauform | 357-BGA (PBGA 25x25 mm) | 357-PBGA (25x25 mm) |
| Process Technology | 0.32 micrometer CMOS | 0.32 µm CMOS |
| Instruction Cache | 4 KB | 4 Kbyte |
| Data Cache | 4 KB | 4 Kbyte |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | DRAM, SRAM, EPROM, Flash |
| Number of Cores | 1 | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: rohs compliance] |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Core Count | — | 1 |
| Maximale Taktfrequenz | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Betriebstemperaturbereich | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |