MPC860TVR80D4 - 80 MHz PowerQUICC MPC8xx MPU | NXP
MPN: MPC860TVR80D4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $21.95 | $2,195.00 |
| 500 | $18.2 | $9,100.00 |
| 1,000 | $14.85 | $14,850.00 |
MPC860TVR80D4 Overview
An MPU (Microprocessor Unit) is the central processing IC of an embedded system, integrating CPU core(s), memory controllers, bus interfaces, and peripherals on a single die. PowerQUICC MPC8xx parts are part of the broader PowerPC/Power Architecture family that originated at IBM and was productized for embedded networking by Motorola/Freescale/NXP. MPC860 sits between the simpler MPC850/855 and the more capable MPC8260, optimized for cost-sensitive telecom and routing designs.
Key features include 80 MHz core and CPM clock, 4 KB I-cache / 4 KB D-cache, integrated memory controller supporting DRAM, SRAM, Flash, and EDO, three Fast Communications Controllers (FCC), four Serial Communications Controllers (SCC), two Serial Management Interfaces (SMC), and a 10/100 Ethernet MAC. Operating voltage is 3.3 V with 5 V tolerant I/O on selected pins. Power consumption is moderate for the 0.32 micrometer CMOS process.
The MPC860TVR80B uses Harvard-style separate instruction and data paths for the PowerPC core and a separate RISC CPM for peripheral offload. This dual-engine architecture offloads DMA and protocol handling from the CPU, sustaining throughput on multiple serial links without starving application code.
Typical applications include 10/100 Ethernet routers, ISDN/DSL gateways, remote access concentrators, T1/E1 multiplexers, industrial control with Ethernet, and legacy telecom line cards. The integrated CPM and rich peripheral set make it a single-chip solution for many wired networking designs.
When designing with the MPC860TVR80B, follow the reference manual power-sequencing guidance, place decoupling capacitors as close as possible to each BGA ball cluster, and ensure JTAG is accessible for boundary-scan bring-up. The 25x25 mm PBGA requires a 4-6 layer PCB with microvia stack-up. Note that this part has reached NXP End of Life, so design-in to a new platform is not recommended - use it only for sustaining legacy designs.
This page consolidates datasheet specs, drop-in same-package alternatives sourced from NXP's PowerQUICC family, and practical design guidance not found on a single distributor listing.
Drop-in alternatives for MPC860TVR80D4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC860TVR80D4 (same form factor and footprint) — differing in Core Architecture, Process Technology, RoHS Status, Mounting Type, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC860TVR80B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860TZQ80D4
✅ Drop-In✓ In Stock
$24.4 / Unit
View Datasheet →MPC862TVR80B
✅ Drop-In✓ In Stock
$52 / Unit
View Datasheet →MPC860TVR50D4
✅ Drop-In✓ In Stock
$58 / Unit
View Datasheet →MPC855TVR80D4
✅ Drop-In✓ In Stock
$64.5 / Unit
View Datasheet →MPC860DEVR80D4
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →MPC860TVR80D4 Maximum Ratings & Electrical Characteristics
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz |
| Operating Voltage | 3.3 V |
| Package / Case | 357-BGA (PBGA 25x25 mm) |
| Process Technology | 0.32 micrometer CMOS |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | 10/100 Mbps integrated |
| Memory Controller | DRAM, SRAM, Flash, EDO support |
| Number of Cores | 1 |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Mounting Type | Surface Mount (BGA) |
MPC860TVR80D4 357-bga (pbga 25x25 mm) Pin Configuration Guide
Pin configuration for MPC860TVR80D4 (357-bga (pbga 25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC860TVR80D4.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC860TVR80D4 is suitable for 6 applications: 10/100 Ethernet Router, ISDN / DSL Gateway, T1/E1 Multiplexer and Telecom Line Card, Remote Access Concentrator, Industrial Control with Ethernet, Legacy Printer and Imaging Controller.
10/100 Ethernet Router
The MPC860TVR80D4 fits 10/100 Ethernet router designs because the integrated 10/100 Ethernet MAC and three Fast Communications Controllers (FCCs) handle WAN uplink plus LAN side without external PHY glue logic. At 80 MHz the PowerPC core sustains routing table lookups while the RISC CPM offloads packet DMA, sustaining wire-speed forwarding for typical home/SOHO router workloads. Engineers should pair the MPC860TVR80D4 with an external PHY over MII or RMII and use the on-chip DRAM controller for packet buffers. Legacy designs can drop in the MPC860TVR80B or MPC862TVR80B on the same 357-ball PBGA footprint without PCB rework.
Recommended
ISDN / DSL Gateway
The MPC860TVR80D4 is widely deployed in ISDN and early DSL customer-premises equipment (CPE) because its FCC and SCC channels natively handle HDLC framing for D-channel signaling and SAR for U-interface data. The 80 MHz core plus RISC CPM offload is sufficient to terminate PPPoE, IPsec, and voice over DSL codec work in a single chip. The 3.3 V core supply and 357-ball PBGA integrate cleanly into CPE thermal envelopes. When the BOM needs a lower-cost fallback for slower DSL lines, the MPC860TVR50D4 keeps the same 357-BGA footprint.
Recommended
T1/E1 Multiplexer and Telecom Line Card
The MPC860TVR80D4 is suited for T1/E1 multiplexer and telecom line-card applications because its four SCCs and dedicated time-slot assigner map cleanly onto TDM buses such as H.110 and SCSA. The CPM handles per-channel HDLC or transparent bit-stream protocol without CPU intervention, freeing the PowerPC core for higher-layer signaling and OAM&P housekeeping. At 3.3 V core and 25x25 mm PBGA, the part drops into standard line-card form factors. Use the MPC860TVR80B as a same-footprint drop-in if supply tightens.
Recommended
Remote Access Concentrator
The MPC860TVR80D4 fits remote access concentrators because the integrated CPM can terminate dozens of PPP, MP, and synchronous HDLC sessions across multiple SCC channels, while the 80 MHz PowerPC core runs RADIUS, TACACS+, and IP routing stacks concurrently. The on-chip memory controller supports DRAM for session tables and Flash for firmware, removing external glue logic. This reduces BOM cost compared to a discrete CPU-plus-comm-controller solution. For higher port density, migrating to the MPC862TVR80B adds ATM support on the same 357-ball PBGA.
Recommended
Industrial Control with Ethernet
The MPC860TVR80D4 is a fit for industrial controllers with embedded Ethernet because its deterministic CPM offload and PowerPC core provide predictable latency for control loops while still supporting 10/100 Ethernet for SCADA connectivity. Use the MPC860TZQ80D4 if the cabinet must operate across -40 C to +85 C. The 357-ball PBGA at 25x25 mm drops onto industrial backplanes that already host PowerQUICC designs. For new industrial designs consider QorIQ LS1021A, but for sustaining 860TVR.x platforms the same-footprint TZ variant is the path of least disruption.
Recommended
Legacy Printer and Imaging Controller
The MPC860TVR80D4 is suitable for legacy printer and imaging engine controllers because the SCC and SMC channels drive high-speed serial engines for print heads and scanners, while the PowerPC core runs the page-description-language interpreter (PostScript, PCL, PDF). The integrated DRAM controller holds frame buffers without external memory bridge logic. Many commercial MFP platforms built in the early 2000s used this exact silicon, and the 357-ball PBGA enables direct board replacement during service. For service-stocking programs the MPC860TVR80B is a same-footprint drop-in.
Recommended
Recommended Products Summary
Engineering reference data for MPC860TVR80D4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860TVR80B | MPC860TZQ80D4 | MPC862TVR80B | MPC860TVR50D4 | MPC855TVR80D4 | MPC860DEVR80D4 |
|---|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 80 MHz | 80 MHz |
| Operating Temperature | 0C to +70C (commercial, inferred from grade) | 0C to +70C | -40C to +85C (extended) | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
| FCC Channels | 3 | 3 | 3 | 3 | 3 | 1 | 3 |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 with switch engine | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| ATM / HDLC Support | HDLC via SCC | HDLC via SCC | HDLC via SCC | HDLC + ATM | HDLC via SCC | HDLC via SCC | HDLC via SCC |
| RoHS Status | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | EOL |
Key Differentiators
- Three FCC channels at 80 MHz (vs MPC855TVR80D4)
- Commercial temperature grade variant (vs MPC860TZQ80D4)
- HDLC and synchronous protocol offload in CPM (vs MPC862TVR80B)
Design Notes
The 357-ball PBGA at 25x25 mm with 1.27 mm pitch requires a 4-6 layer PCB and microvia or via-in-pad stack-up for reliable assembly. Decoupling capacitors must be placed within 2-3 mm of each power-ball cluster. Use a continuous ground plane on layer 2 and a power plane on layer 3 to control impedance for the memory bus. Per NXP PowerQUICC design guides, trace length matching on the memory bus should be within 25 ps skew.
Apply 3.3 V core supply first, then drive PORESET low-to-high after the supply stabilizes for at least 100 microseconds. The MPC860TVR80D4 does not support hot-swap or live insertion; in-service card designs must use staggered power planes and inrush limiters. Place a bulk capacitor of at least 220 microfarads near the BGA core supply balls, plus 0.1 microfarad ceramics adjacent to each supply pin pair.
Estimated: at 80 MHz and 3.3 V with all FCCs and SCCs active, the MPC860TVR80D4 dissipates approximately 1.2 W. With a typical PBGA theta_JA of 18 C/W on a JEDEC 4-layer test board, the junction temperature rise above ambient is around 22 C. Sustained 85 C ambient keeps Tj under 110 C, well within the commercial grade limit. For sealed enclosures, derate by 25 percent to account for reduced convection.
Do not migrate firmware built for the MPC860 to the MPC862 without verifying CPM interrupt vector mapping - the 862 repositions several SIU registers. Do not assume the MPC855TVR80D4 is a drop-in; it has only one FCC versus the 860's three. Do not omit the HRESET pull-up resistor; the MPC860TVR80D4 will sample unpredictable boot vectors without it. Always validate boot via JTAG boundary-scan before attaching peripherals.
Compliance Information
RoHS compliant and lead-free per DigiKey product listing. REACH, halogen-free, and conflict-minerals status were not present in the verified web data and are marked unknown.
