MPC870ZT133 vs MPC875VR133 Comparison
Detailed side-by-side comparison of MPC870ZT133 by NXP Semiconductors and MPC875VR133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC870ZT133 | MPC875VR133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $28.75 | $27.90 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (32-bit RISC) |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Supply Voltage | 3.3 V I/O, 1.8 V core | — |
| Operating Temperature | 0C to +95C (commercial) | 0 °C to +95 °C |
| Package / Case | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Contains Lead | — |
| RoHS Status | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Performance | — | 176 MIPS |
| Data Bus Width | — | 32 bit |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| MSL Level | — | [DATA_NEEDED: MSL level] |