MPC870ZT133 vs MPC875VR133 Vergleich
Detaillierter Direktvergleich von MPC870ZT133 von NXP Semiconductors und MPC875VR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC870ZT133 | MPC875VR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $28,75 | $27,90 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (32-bit RISC) |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Versorgungsspannung | 3.3 V I/O, 1.8 V core | — |
| Betriebstemperatur | 0C to +95C (commercial) | 0 °C to +95 °C |
| Gehäuse / Bauform | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Contains Lead | — |
| RoHS-Status | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Performance | — | 176 MIPS |
| Datenbusbreite | — | 32 bit |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |