MPC870ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP | 256-BGA
MPN: MPC870ZT133 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $28.75 | $28,750.00 |
MPC870ZT133 Overview
A microprocessor (MPU) is a single-chip processing unit that fetches, decodes, and executes instructions from memory; the MPC870ZT133 is positioned within the broader category hierarchy of microprocessor -> MPU -> microcontroller-adjacent processor -> integrated communications processor -> Power Architecture embedded device. It specifically targets cost-sensitive networking designs that previously required a separate CPU plus an external communications controller.
Key features include a 32-bit Power Architecture core, dual 10/100 Mbps Ethernet MACs on-chip, HDLC/SDLC channels, an external 32-bit data bus, and a 3.3 V I/O supply with a 1.8 V core voltage. The integrated CPM offloads serial protocol processing from the core, enabling sustained throughput on multiple WAN ports without burdening the CPU.
From an architectural standpoint the part combines a G2_LE core with the CPM, sharing memory through an internal SIU (System Interface Unit). The 256-ball PBGA package provides high I/O density for the address, data, and peripheral buses while keeping board layout compact. Designers benefit from reduced component count and validated PowerQUICC toolchain support (Green Hills, Wind River, Linux PPC).
Typical applications include low-end routers and DSLAM line cards, industrial Ethernet gateways, serial-to-Ethernet protocol converters, and legacy telecom control plane processors. The 133 MHz speed grade offers a balance between throughput and power consumption for these mid-range communications designs.
When designing with this device, allocate sufficient PCB layers (minimum 4 layers recommended) to route the 256-ball BGA escape and provide low-impedance power planes for the 1.8 V and 3.3 V rails. Decoupling must follow the reference manual's bulk/ceramic capacitor distribution around the BGA perimeter.
This page synthesizes distributor stock, drop-in alternative MPNs within the MPC8xx family, and design notes not found in the manufacturer datasheet alone, accelerating sourcing decisions for engineers maintaining legacy PowerQUICC designs.
Drop-in alternatives for MPC870ZT133 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC870ZT133 (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Manufacturer, Package, Package Code.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC875ZT133
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →MPC870CZT133
✅ Drop-In✓ In Stock
$71 / Unit
View Datasheet →MPC880ZT133
✅ Drop-In📋 Reference alternative (not in catalog)
MPC870ZT80
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →MPC870ZT133 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. (formerly Freescale) |
| Product Family | PowerQUICC MPC8xx |
| Processor Type | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | Power Architecture (G2_LE) |
| Core Frequency | 133 MHz |
| Number of Cores | 1 |
| External Data Bus Width | 32-bit |
| Supply Voltage | 3.3 V I/O, 1.8 V core |
| Operating Temperature | 0C to +95C (commercial) |
| Package / Case | 256-PBGA (23 x 23 mm) |
| Terminal Form | BALL |
| Number of Terminals | 256 |
| Package Code | HBGA |
| Mounting Type | Surface Mount |
| Lead Free Status | Contains Lead |
| RoHS Status | Non-Compliant (legacy part) |
| Packaging | Tray |
MPC870ZT133 hbga Pin Configuration Guide
Pin configuration for MPC870ZT133 (hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC870ZT133.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC870ZT133 is suitable for 6 applications: Low-End Router / DSLAM Line Card, Industrial Ethernet Gateway, Serial-to-Ethernet Protocol Converter, Legacy Telecom Control Plane Processor, Network Attached Storage Controller Board, Embedded Linux Communications Appliance.
Low-End Router / DSLAM Line Card
The MPC870ZT133 fits low-end router and DSLAM line card designs because its integrated dual 10/100 Ethernet MACs and HDLC channels allow designers to terminate subscriber lines without an external serial controller. At 133 MHz the G2_LE core handles forwarding table lookups, routing protocols, and management plane tasks with sustained throughput across multiple Fast Ethernet ports. Its 32-bit external data bus supports commodity SDRAM, reducing total BOM. The 256-PBGA package enables high-density multilayer boards typical of telecom line cards, while the PowerQUICC toolchain (Green Hills, Wind River, Linux PPC) accelerates firmware porting from earlier MPC8xx designs.
Recommended
Industrial Ethernet Gateway
The MPC870ZT133 is suitable for industrial Ethernet gateways where deterministic serial-to-Ethernet protocol conversion is required. Its on-chip CPM offloads HDLC/PPP and UART handling from the core, allowing the G2_LE processor to manage application-layer protocols concurrently. The 3.3 V I/O simplifies interface to typical industrial PHY transceivers, while the 1.8 V core keeps total power within embedded DIN-rail budgets. Operating temperature of 0 to +95C covers most factory-floor enclosures. The 256-PBGA footprint allows compact integration alongside PHY, magnetics, and isolation on the same PCB.
Recommended
Serial-to-Ethernet Protocol Converter
Engineers choose the MPC870ZT133 for serial-to-Ethernet protocol converters because the integrated CPM handles multiple SCC channels simultaneously, allowing RS-232/RS-485 or HDLC frames to be encapsulated into TCP/IP without burdening the CPU. The 32-bit external bus moves packet buffers through SDRAM with minimal latency, while 133 MHz provides enough headroom for protocol stacks. Legacy industrial protocols (Modbus, DF1, proprietary serial) can be tunneled into Ethernet via well-documented MPC8xx CPM drivers, reducing firmware risk versus bare-metal MCU implementations.
Recommended
Legacy Telecom Control Plane Processor
In legacy telecom control plane designs the MPC870ZT133 continues to provide reliable processing for SS7, ISDN, and central-office management functions. The PowerQUICC architecture was widely deployed in Class 5 switches and access muxes, and many carriers maintain installed bases that depend on the MPC8xx family for spare-part replacement. The 133 MHz speed grade handles call-processing state machines and Q.931/Q.931-bis signaling, while the 256-PBGA package suits the high-density backplane cards used in legacy central offices. The non-RoHS, lead-bearing construction matches the original telecom build standards.
Recommended
Network Attached Storage Controller Board
The MPC870ZT133 can drive entry-level network attached storage (NAS) controller boards, where its dual Ethernet MACs enable link-aggregation or dual-LAN topologies. The 32-bit external data bus connects to IDE/ATA or SATA bridge ASICs, and the CPM's DMA channels accelerate block-transfer offload. At 133 MHz the G2_LE core runs lightweight embedded filesystems (JFFS2, ext2) suitable for SOHO NAS appliances. The 256-PBGA package integrates easily with memory and PHY subsystems on a 4-layer PCB.
Recommended
Embedded Linux Communications Appliance
Designers building embedded Linux communications appliances leverage the MPC870ZT133's mainline Linux PPC kernel support, enabling rapid deployment of standard networking stacks (iptables, PPPoE, OpenVPN). The 133 MHz core runs busybox-based userland, while the CPM handles hardware-accelerated serial and Ethernet DMA. With 32-bit SDRAM and standard U-Boot bootloaders, the platform is well-documented in open-source communities, shortening development cycles for appliances such as VPN routers, firewall edge devices, and SCADA protocol gateways.
Recommended
Recommended Products Summary
Engineering reference data for MPC870ZT133 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC875ZT133 | MPC870CZT133 | MPC880ZT133 | MPC870ZT80 |
|---|---|---|---|---|---|
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz (with enhanced CPM) | 80 MHz |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (G2_LE) | Power Architecture (G2_LE) | Power Architecture (G2_LE) | Power Architecture (G2_LE) |
| External Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| On-chip Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 (with Fast Ethernet enhancements) | 2x 10/100 |
| Operating Temperature | 0C to +95C | 0C to +95C | -40C to +105C (extended grade) | 0C to +95C | 0C to +95C |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) | Non-Compliant (contains lead) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Cost-optimized within the MPC8xx family (vs MPC880ZT133)
- Extended temperature option available within same family (vs MPC870ZT133 (standard))
- Same-package pin-compatible upgrade within MPC8xx (vs MPC870ZT80)
Design Notes
The 256-ball PBGA at 1.27 mm pitch requires a minimum of 4 PCB layers with a solid ground plane directly beneath the device. Escape routing on the top layer should use 0.005-inch (0.127 mm) traces between balls; the second layer should be a continuous ground pour stitched with vias at every ball-grid interstitial. Use laser-drilled microvias or 0.008-inch dog-bone fan-out if your fab supports it; otherwise 4-layer through-hole designs with 0.012-inch outer trace widths are the safe baseline. Per the NXP MPC8xx hardware specification, controlled-impedance routing of the 32-bit external data bus to SDRAM must target 50 ohms single-ended to avoid bus timing violations at 133 MHz.
Provide separate 3.3 V I/O and 1.8 V core rails, each decoupled with a bulk 47-100 uF tantalum or polymer cap plus 0.1 uF ceramic caps at every 6-8 balls around the BGA perimeter. The 1.8 V core must ramp monotonically before or simultaneously with the 3.3 V I/O per NXP power sequencing requirements; a violation can latch the part. Estimated: under typical 133 MHz operation the core draws roughly 500-700 mA at 1.8 V (approx 1.0-1.3 W) and I/O draws 200-400 mA at 3.3 V (approx 0.7-1.3 W), but consult the datasheet DC characteristics for definitive values. Place the supervisor IC reset output to drive the PORESET pin until both rails stabilize.
Although the 256-PBGA package has a moderate theta_JA (typically 20-25 C/W on a 4-layer JEDEC test board), the 1.0-1.3 W core dissipation plus I/O power can push junction temperature up to 70-85C in still air at 25C ambient. For enclosures without airflow, add thermal vias in the BGA pad array to a copper pour on the opposite side of the PCB. If your application operates above +70C ambient, derate accordingly or migrate to the extended-temperature MPC870CZT133 variant which is rated to +105C.
Do not assume the MPC870ZT133 is RoHS-compliant - it contains lead. The legacy ZT speed grades were never transitioned to lead-free; if your end product requires RoHS, this part cannot be used. Also, the obsolete lifecycle status means new boards should consider the MPC82xx or QorIQ families instead, or use MPC875ZT133 as a drop-in where possible. Avoid mixing 5 V peripherals directly to the 3.3 V I/O without level shifters; the MPC8xx I/O is not 5 V tolerant in most configurations.
Compliance Information
MPC870ZT133 contains lead and is RoHS non-compliant per DigiKey/Mouser listings. REACH, halogen-free, and conflict-mineral status were not stated in the verified web data; treat as unknown unless confirmed against a vendor declaration.