MPC880ZP133 vs MPC875ZT133 Comparison

Detailed side-by-side comparison of MPC880ZP133 by NXP Semiconductors and MPC875ZT133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC880ZP133 MPC880ZP133 - 133MHz PowerQUICC MPU, 32-Bit | 357-BGA | NXP

MPC880ZP133 - 133MHz PowerQUICC MPU, 32-Bit | 357-BGA | NXP

MPC880ZP133 ✗ End of Life
NXP Semiconductors
MPC875ZT133 MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors

MPC875ZT133 ✗ End of Life

Specification Comparison

Parameter MPC880ZP133 MPC875ZT133
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life End of Life
Stock Status In Stock In Stock
Unit Price (USD) $26.10 $19.85
Core Architecture PowerQUICC (8xx core + CPM RISC) Power Architecture (PowerPC) 32-bit
Core Processor MPC8xx —
Number of Cores 1 —
Data Bus Width 32-Bit —
Core Frequency 133 MHz 133 MHz
Instruction Cache 8 KB —
Data Cache 8 KB —
Package 357-PBGA (25 mm x 25 mm) 256-ball PBGA (23x23 mm)
Mounting Type Surface Mount (BGA) Surface Mount
Operating Temperature 0C to +95C 0C to +95C
On-chip Security Yes —
Memory Controller Integrated (powerful memory controller per datasheet) External SDRAM/Flash bus (integrated)
Family MPC8xx / MPC880 / MPC885 MPC8xx / PowerQUICC
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: rohs status]
Supply Voltage [DATA_NEEDED: core/IO voltage] —
Core Count — 1
Package Code — HBGA, Grid Array with Heat Sink/Slug
Maximum Supply Voltage — 1.9 V
Terminal Form — BALL
Number of Terminals — 256
Communications Processor Module (CPM) — Yes (on-chip)
Ethernet MAC — 10/100 Mbps (Fast Ethernet, integrated)
Lifecycle Status — End of Life (per NXP discontinuance notice)
Instruction Set — Power Architecture 32-bit

Datasheets & Resources

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