MPXS3010VMM150 vs SPC5645SF1VVU Comparison

Detailed side-by-side comparison of MPXS3010VMM150 by NXP Semiconductors and SPC5645SF1VVU by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
SPC5645SF1VVU SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU ✓ Active

Specification Comparison

Parameter MPXS3010VMM150 SPC5645SF1VVU
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $23.95 $27.10
Core Architecture Power Architecture e200z7d (dual-core) Power Architecture e200z4d (dual-core lockstep option)
Number of Cores 2 —
Core Bit Width 32-bit —
Maximum CPU Clock 150 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
RAM Size 256 KB (256K x 8) —
Oscillator Type External (per datasheet) —
Package / Case 257-LFBGA (14x14 mm) 416-PBGA (27x27 mm, 1.0 mm pitch)
Mounting Type Surface Mount Surface Mount
Terminal Form BALL (BGA) —
Number of Terminals 257 —
Package Code LFBGA —
Temperature Grade INDUSTRIAL —
Series PXS30 —
Manufacturer NXP Semiconductors (formerly Freescale) —
RoHS Status [DATA_NEEDED: rohs status] Compliant
Data Bus Width — 32-bit
Maximum Clock Frequency — 125 MHz
Program Memory Size — 2 MB Flash
Program Memory Type — Flash with ECC
SRAM Size — [DATA_NEEDED: SRAM size in KB]
Supply Voltage — 3.3 V / 5 V tolerant I/O
Operating Temperature Range — -40 C to +105 C
AEC-Q100 Qualification — Yes (Automotive Grade)
Functional Safety — Targeting ASIL-D (dual-core lockstep)
CAN Controllers — Dual CAN 2.0B (FlexCAN)
FlexRay — Yes, dual-channel FlexRay module
Ethernet — [DATA_NEEDED: Ethernet MAC availability]
Graphics Accelerator — Yes, integrated GFXPU for TFT cluster
ADC — 12-bit ADC, multi-channel
Timers — eMIOS unified channels
Debug Interface — JTAG / Nexus 5001 (Level 3 trace)
Process Technology — 90 nm CMOS
JEDEC MSL — MSL3 (per PBGA JEDEC J-STD-020)

Datasheets & Resources

Browse All Products Create BOM Request Quote