MPXS3010VMM150 vs SPC5645SF1VVU 비교
다음의 상세 나란히 비교: MPXS3010VMM150 제조: NXP Semiconductors 및 SPC5645SF1VVU 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
MPXS3010VMM150 ✓ 활성
사양 비교
| 파라미터 | MPXS3010VMM150 | SPC5645SF1VVU |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $23.95 | $27.10 |
| Core Architecture | Power Architecture e200z7d (dual-core) | Power Architecture e200z4d (dual-core lockstep option) |
| Number of Cores | 2 | — |
| Core Bit Width | 32-bit | — |
| Maximum CPU Clock | 150 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| RAM Size | 256 KB (256K x 8) | — |
| Oscillator Type | External (per datasheet) | — |
| 패키지 / 케이스 | 257-LFBGA (14x14 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount | Surface Mount |
| Terminal Form | BALL (BGA) | — |
| Number of Terminals | 257 | — |
| Package Code | LFBGA | — |
| Temperature Grade | INDUSTRIAL | — |
| Series | PXS30 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| RoHS 상태 | [DATA_NEEDED: rohs status] | Compliant |
| 데이터 버스 폭 | — | 32-bit |
| 최대 클록 주파수 | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| 공급 전압 | — | 3.3 V / 5 V tolerant I/O |
| 동작 온도 범위 | — | -40 C to +105 C |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |