MPXS3010VMM150 vs SPC5645SF1VVU Vergleich
Detaillierter Direktvergleich von MPXS3010VMM150 von NXP Semiconductors und SPC5645SF1VVU von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
MPXS3010VMM150 ✓ AktivNXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ AktivSpezifikationsvergleich
| Parameter | MPXS3010VMM150 | SPC5645SF1VVU |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,95 | $27,10 |
| Core Architecture | Power Architecture e200z7d (dual-core) | Power Architecture e200z4d (dual-core lockstep option) |
| Number of Cores | 2 | — |
| Core Bit Width | 32-bit | — |
| Maximum CPU Clock | 150 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| RAM Size | 256 KB (256K x 8) | — |
| Oscillator Type | External (per datasheet) | — |
| Gehäuse / Bauform | 257-LFBGA (14x14 mm) | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | BALL (BGA) | — |
| Number of Terminals | 257 | — |
| Package Code | LFBGA | — |
| Temperature Grade | INDUSTRIAL | — |
| Series | PXS30 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Versorgungsspannung | — | 3.3 V / 5 V tolerant I/O |
| Betriebstemperaturbereich | — | -40 C to +105 C |
| AEC-Q100 Qualification | — | Yes (Automotive Grade) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Debug Interface | — | JTAG / Nexus 5001 (Level 3 trace) |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |