MPXV7025GP vs MPVZ7025DP Comparison
Detailed side-by-side comparison of MPXV7025GP by NXP Semiconductors and MPVZ7025DP by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ ActiveNXP Semiconductors
MPVZ7025DP - ±3.63 PSI Differential Pressure Sensor, 8-BSOP | NXP
MPVZ7025DP ObsoleteSpecification Comparison
| Parameter | MPXV7025GP | MPVZ7025DP |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.50 | $20.09 |
| Pressure Type | Compound (positive and vacuum) | Differential |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | ±3.63 PSI (±25 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Output Type | Analog voltage | Analog Voltage |
| Output Voltage Range | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Output Span | 4.5 V (typical) | 4.5 V nominal (0.2 V to 4.7 V) |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| Supply Voltage | 5 V typical (ratiometric output) | 5 V typical [DATA_NEEDED: supply voltage range] |
| Supply Current | [DATA_NEEDED: supply current] | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | [DATA_NEEDED: total accuracy over temperature] |
| Operating Temperature | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Package / Case | 8-SMD, Gull Wing, Side Port | 8-BSOP (0.475 inch / 12.06 mm Width) |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Port Style | Single side port with barbed stem | Dual Ports, Same Side |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Port Size | — | Male, 0.13 inch (3.3 mm) OD Tube, Dual |
| Sensor Technology | — | Piezoresistive (MEMS silicon) |
| Signal Conditioning | — | On-chip, calibrated, temperature compensated |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |