MPXV7025GP vs MPVZ7025DP Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPXV7025GP disebabkan oleh NXP Semiconductors dan MPVZ7025DP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ AktifNXP Semiconductors
MPVZ7025DP - ±3.63 PSI Differential Pressure Sensor, 8-BSOP | NXP
MPVZ7025DP ObsoletePengandingan Spesifikasi
| Parametr | MPXV7025GP | MPVZ7025DP |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Pressure Type | Compound (positive and vacuum) | Differential |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | ±3.63 PSI (±25 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Jenis Output | Analog voltage | Analog Voltage |
| Gambaran Tegangan Output | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Output Span | 4.5 V (typical) | 4.5 V nominal (0.2 V to 4.7 V) |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| Tegangan Pemberi Arus | 5 V typical (ratiometric output) | 5 V typical [DATA_NEEDED: supply voltage range] |
| Arus Pemberi Arus | [DATA_NEEDED: supply current] | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | [DATA_NEEDED: total accuracy over temperature] |
| Suhu Operasi | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Kemasan / Case | 8-SMD, Gull Wing, Side Port | 8-BSOP (0.475 inch / 12.06 mm Width) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Port Style | Single side port with barbed stem | Dual Ports, Same Side |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Port Size | — | Male, 0.13 inch (3.3 mm) OD Tube, Dual |
| Sensor Technology | — | Piezoresistive (MEMS silicon) |
| Signal Conditioning | — | On-chip, calibrated, temperature compensated |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |