MPXV7025GP vs MPVZ7025DP Vergleich
Detaillierter Direktvergleich von MPXV7025GP von NXP Semiconductors und MPVZ7025DP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ AktivNXP Semiconductors
MPVZ7025DP - ±3.63 PSI Differential Pressure Sensor, 8-BSOP | NXP
MPVZ7025DP ObsoleteSpezifikationsvergleich
| Parameter | MPXV7025GP | MPVZ7025DP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,50 | $20,09 |
| Pressure Type | Compound (positive and vacuum) | Differential |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | ±3.63 PSI (±25 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Ausgangstyp | Analog voltage | Analog Voltage |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Output Span | 4.5 V (typical) | 4.5 V nominal (0.2 V to 4.7 V) |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| Versorgungsspannung | 5 V typical (ratiometric output) | 5 V typical [DATA_NEEDED: supply voltage range] |
| Versorgungsstrom | [DATA_NEEDED: supply current] | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | [DATA_NEEDED: total accuracy over temperature] |
| Betriebstemperatur | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Gehäuse / Bauform | 8-SMD, Gull Wing, Side Port | 8-BSOP (0.475 inch / 12.06 mm Width) |
| Montageart | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Port Style | Single side port with barbed stem | Dual Ports, Same Side |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Port Size | — | Male, 0.13 inch (3.3 mm) OD Tube, Dual |
| Sensor Technology | — | Piezoresistive (MEMS silicon) |
| Signal Conditioning | — | On-chip, calibrated, temperature compensated |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |