MSC8156ESVT1000B vs MSC8156HAG1000B Comparison

Detailed side-by-side comparison of MSC8156ESVT1000B by NXP Semiconductors and MSC8156HAG1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8156ESVT1000B MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783

MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783

MSC8156ESVT1000B Obsolete
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Active

Specification Comparison

Parameter MSC8156ESVT1000B MSC8156HAG1000B
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $138.00 $198.75
Manufacturer NXP Semiconductors (formerly Freescale) —
Series StarCore —
Type SC3850 Six Core DSP —
Number of Cores 6 —
Core Architecture StarCore SC3850 —
Clock Rate 1 GHz —
On-Chip RAM 576 KB —
Non-Volatile Memory ROM 96 KB —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Unified L2 Cache 512 KB —
Voltage - I/O 2.50 V —
Voltage - Core 1.00 V —
Interface Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART —
Package 783-BBGA, FCBGA 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Packaging Tray —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] 0C to +105C
RoHS Status [DATA_NEEDED: RoHS status] Compliant (per distributor datasheet listing)
Product Type — Multi-core Digital Signal Processor (DSP)
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
On-chip ROM — 96 KB
Hardware Accelerator — MAPLE-B (turbo/Viterbi FEC)
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Ethernet — 2 x Gigabit Ethernet (SGMII/RGMII)
Queuing Engine — Yes (QE for packet/traffic management)
Peripheral Interfaces — SPI, I2C, UART, PCI
Process Technology — CMOS
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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