MSC8156ESVT1000B vs MSC8156HAG1000B Comparação

Comparação detalhada lado a lado de MSC8156ESVT1000B por NXP Semiconductors e MSC8156HAG1000B por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MSC8156ESVT1000B MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783

MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783

MSC8156ESVT1000B Obsolete
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Ativo

Comparação de especificações

Parâmetro MSC8156ESVT1000B MSC8156HAG1000B
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida Obsolete Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $138,00 $198,75
Manufacturer NXP Semiconductors (formerly Freescale) —
Series StarCore —
Type SC3850 Six Core DSP —
Number of Cores 6 —
Core Architecture StarCore SC3850 —
Clock Rate 1 GHz —
On-Chip RAM 576 KB —
Non-Volatile Memory ROM 96 KB —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Unified L2 Cache 512 KB —
Voltage - I/O 2.50 V —
Voltage - Core 1.00 V —
Interface Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART —
Encapsulamento 783-BBGA, FCBGA 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Packaging Tray —
Tipo de montagem Surface Mount Surface Mount
Temperatura de operação [DATA_NEEDED: operating temperature range] 0C to +105C
Status RoHS [DATA_NEEDED: RoHS status] Compliant (per distributor datasheet listing)
Product Type — Multi-core Digital Signal Processor (DSP)
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
On-chip ROM — 96 KB
Hardware Accelerator — MAPLE-B (turbo/Viterbi FEC)
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Ethernet — 2 x Gigabit Ethernet (SGMII/RGMII)
Queuing Engine — Yes (QE for packet/traffic management)
Peripheral Interfaces — SPI, I2C, UART, PCI
Process Technology — CMOS
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)
Nível MSL — [DATA_NEEDED: MSL rating]

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