MSC8156ESVT1000B vs MSC8156HAG1000B Vergleich
Detaillierter Direktvergleich von MSC8156ESVT1000B von NXP Semiconductors und MSC8156HAG1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B ObsoleteSpezifikationsvergleich
| Parameter | MSC8156ESVT1000B | MSC8156HAG1000B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,00 | $198,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore | — |
| Type | SC3850 Six Core DSP | — |
| Number of Cores | 6 | — |
| Core Architecture | StarCore SC3850 | — |
| Clock Rate | 1 GHz | — |
| On-Chip RAM | 576 KB | — |
| Non-Volatile Memory | ROM 96 KB | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB | — |
| Voltage - I/O | 2.50 V | — |
| Voltage - Core | 1.00 V | — |
| Schnittstelle | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Gehäuse | 783-BBGA, FCBGA | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Packaging | Tray | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor datasheet listing) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |